Semiconductor device and manufacturing method of semiconductor device using metal oxide

US9515189B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9515189-B2
Application numberUS-201514879423-A
CountryUS
Kind codeB2
Filing dateOct 9, 2015
Priority dateOct 25, 2012
Publication dateDec 6, 2016
Grant dateDec 6, 2016

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A method of manufacturing a semiconductor device using a metal oxide includes forming a metal oxide layer on a substrate, forming an amorphous semiconductor layer on the metal oxide layer, and forming a polycrystalline semiconductor layer by crystallizing the amorphous semiconductor layer using the metal oxide layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor device comprising: a polycrystalline semiconductor layer on a substrate, the polycrystalline semiconductor layer excluding a metal; a metal silicide on a surface of the polycrystalline semiconductor layer; and a metal oxide layer between the substrate and the polycrystalline semiconductor layer, wherein the polycrystalline semiconductor layer has a (111) crystallization orientation during crystallization using the metal oxide layer and the polycrystalline semiconductor layer. 2. The semiconductor device of claim 1 , further comprising: an insulating layer between the substrate and the polycrystalline semiconductor layer. 3. The semiconductor device of claim 1 , wherein the insulating layer is one of SiO 2 and SiN x , wherein 0<x<1.4. 4. The semiconductor device of claim 1 , wherein the substrate is one of a glass substrate and a silicon substrate. 5. The semiconductor device of claim 1 , wherein the metal oxide layer is one of NiO, CuO, ZnO, SnO, AlO x , TiO x , InO x , GaO x , PbO x , and CoO x . 6. The semiconductor device of claim 1 , wherein the polycrystalline semiconductor layer includes one of Si, Ge, and Si 1−x Ge x , wherein 0<x<1. 7. The semiconductor device of claim 1 , wherein the polycrystalline semiconductor layer excludes a metal silicide as part of the polycrystalline semiconductor layer.

Assignees

Inventors

Classifications

  • using crystallisation-enhancing elements · CPC title

  • Polycrystalline · CPC title

  • Silicon, silicon germanium or germanium · CPC title

  • being insulating materials · CPC title

  • being non-crystalline insulating materials, e.g. glass or polymers · CPC title

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Frequently asked questions

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What does patent US9515189B2 cover?
A method of manufacturing a semiconductor device using a metal oxide includes forming a metal oxide layer on a substrate, forming an amorphous semiconductor layer on the metal oxide layer, and forming a polycrystalline semiconductor layer by crystallizing the amorphous semiconductor layer using the metal oxide layer.
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10D62/40. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).