Semiconductor package having multiple substrates
US-2024395683-A1 · Nov 28, 2024 · US
US9515012B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9515012-B2 |
| Application number | US-201514620762-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 12, 2015 |
| Priority date | Feb 17, 2014 |
| Publication date | Dec 6, 2016 |
| Grant date | Dec 6, 2016 |
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The present invention concerns a package of power dies composed of a first part and a second part, the first part including a plaque having cavities on which dies are placed, the plaque is placed on a first, a second, and a third metallic plates placed on an electric insulation substrate placed on a fourth metallic plate, the second part including a fifth and a sixth metallic plates placed on another electric insulation substrate placed on a seventh metallic plate, the dies are divided into a first group of dies and a second group of dies and wherein the first and second plate are a positive and negative DC voltage connections, the third plate is a gate connection of the second group of dies, the fourth plate is an AC voltage connection and the fifth plate is a gate connection of the first group of dies.
Opening claim text (preview).
The invention claimed is: 1. A package of power dies characterized in that the package of power dies is composed of a first part and a second part, the first part is composed of a plaque composed of cavities on which dies are placed, the plaque is placed on a first, a second, and a third metallic plates placed on an electric insulation substrate, the electric insulation layer is placed on a fourth metallic plate, the second part being composed of a fifth and a sixth metallic plates placed on another electric insulation substrate, the other electric insulation layer being placed on a seventh metallic plate, the fourth and the seventh metallic plates are mechanically joined, the dies are divided into two groups of dies, a first group of dies having an electric contact with the first, fifth and sixth metallic plates and a second group of dies being in contact with the second, third and sixth metallic plates and wherein the first plate is a positive DC voltage connection, the second plate is a negative DC voltage connection, the third plate is a gate connection of the dies of the second group of dies, the fourth plate is an AC voltage connection and the fifth plate is a gate connection of the gates of the first group of dies. 2. The package of dies according to claim 1 , characterised in that the first, second and fifth metallic plates extend outside the fourth and the seventh metallic plates mechanically joined and are folded outside the fourth and the seventh metallic plates mechanically joined. 3. The package according to claim 2 , characterised in that the folded parts lie on an interconnection component placed on a mechanical support. 4. The package according to claim 3 , characterized in that the mechanical support is a cover of a reservoir comprising heat transfer medium and the fourth and the seventh metallic plates mechanically joined are emerged in the heat transfer medium. 5. The package according to claim 4 , characterised in that the first, second, third, fifth and sixth metallic plates extend outside the fourth and the seventh metallic plates mechanically joined and are connected to gate drivers of the dies. 6. A three-phase power converter comprising three packages according to claim 1 .
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