Thermal interface materials

Patent metadata

Field	Value
Publication number	US-9515004-B2
Application number	US-201313840119-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Mar 15, 2013
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A thermal interface material is configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device. The thermal interface material generally includes a first material (e.g., a gap filler, etc.) incorporating a contact resistance reducing material. The contact resistance reducing material operates to fill interstitial voids of surfaces of components in which the first material is installed to thereby reduce surface contact resistance between the first material and the component surfaces. The contact resistance reducing material may be applied to one or more side surfaces of the first material. Or, alternatively, the contact resistance reducing material may be blended in the first material.

First claim

What is claimed is:

1. A thermal interface material configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device, the thermal interface material comprising a first material including polymer and a second material including a contact resistance reducing material to thereby reduce surface contact resistance between the first material and heat generating and/or heating removing components of the electronic device, wherein a distinct layer of the second material is applied to and disposed along a side surface of the first material, and wherein:
the second material has a phase change softening temperature less than 125 degrees Celsius; and
the second material conforms to a thermal transfer surface when the thermal interface material is installed and the second material is between the first material and the thermal transfer surface, whereby the second material fills interstitial voids of the thermal transfer surface and/or reduces air gaps between the first material and the thermal transfer surface.

2. The thermal interface material of claim 1 , wherein the second material is applied to, disposed along and distinct from multiple side surfaces of the first material.

3. The thermal interface material of claim 1 , wherein the distinct layer of the second material is a non-reinforced film phase change material on the side surface of the first material that defines an outermost portion of the thermal interface material.

4. The thermal interface material of claim 1 , wherein the first material includes a silicone elastomer gap filler, whereby the second material allows for installing the silicone elastomer gap filler to the thermal transfer surface such that the second material is between the silicone elastomer gap filler and the thermal transfer surface and such that the second material conforms to the thermal transfer surface and reduces air gaps between the silicone elastomer gap filler and the thermal transfer surface.

5. The thermal interface material of claim 4 , wherein the second material includes a non-reinforced film phase change material on at least one side surface of the silicone elastomer gap filler.

6. The thermal interface material of claim 1 , wherein the contact resistance reducing material is laminated, screen printed, coated, or co-extruded on the side surface of the first material.

7. The thermal interface material of claim 1 , wherein the first material includes a preformed sheet of gap filler pad and the second material includes a preformed sheet of phase change material laminated to and disposed along both sides of the preformed sheet of gap filler pad.

8. The thermal interface material of claim 1 , wherein the first material includes a thermoplastic gap filler, whereby the second material allows for installing the thermoplastic gap filler to the thermal transfer surface such that the second material is between the thermoplastic gap filler and the thermal transfer surface and such that the second material conforms to the thermal transfer surface and reduces air gaps between the thermoplastic gap filler and the thermal transfer surface.

9. The thermal interface material of claim 8 , wherein the second material includes a non-reinforced film phase change material on at least one side surface of the thermoplastic gap filler.

10. The thermal interface material of claim 9 , wherein the non-reinforced film phase change material is laminated to and disposed along both sides of the thermoplastic gap filler.

11. The thermal interface material of claim 1 , wherein the first material includes an elastomer gap filler, whereby the second material allows for installing the elastomer gap filler to the thermal transfer surface such that the second material is between the elastomer gap filler and the thermal transfer surface and such that the second material conforms to the thermal transfer surface and reduces air gaps between the elastomer gap filler and the thermal transfer surface.

12. The thermal interface material of claim 11 , wherein the second material includes a non-reinforced film phase change material on at least one side surface of the elastomer gap filler.

13. The thermal interface material of claim 12 , wherein the non-reinforced film phase change material is laminated to and disposed along both sides of the elastomer gap filler.

14. The thermal interface material of claim 1 , wherein the second material is laminated to and disposed along both sides of the first material.

15. The thermal interface material of claim 1 , wherein the first material includes a ceramic filled silicone elastomer gap filler.

16. The thermal interface material of claim 1 , wherein the first material includes a boron nitride filled silicone elastomer gap filler.

17. The thermal interface material of claim 1 , wherein:
the first material includes a boron nitride filled silicone elastomer gap filler; and
the second material includes a non-reinforced film phase change material laminated to and disposed along both sides of the boron nitride filled silicone elastomer gap filler.

18. The thermal interface material of claim 1 , wherein:
the first material includes a silicone elastomer gap filler; and
the second material includes a non-reinforced film phase change material laminated to and disposed along both sides of the silicone elastomer gap filler.

19. The thermal interface material of claim 1 , wherein the first material includes a gap filler pad formed from ceramic filled silicone elastomer, boron nitride filled silicone elastomer, metal/ceramic filled silicone elastomer, or ceramic filled thermoplastic.

20. An electronic device comprising a heat generating and/or heating removing component and the thermal interface material of claim 1 positioned within the electronic device with the second material in contact with a surface of the heat generating and/or heating removing component, wherein the second material operates to flow into and fill interstitial voids of the surface of the heat generating and/or heating removing component and conform thereto to thereby reduce surface contact resistance between the first material and the heat generating and/or heating removing component and lower thermal resistance of the thermal interface material.

Assignees

• Laird Technologies Inc

Inventors

• Strader Jason L
• Bruzda Karen J
• Hill Richard F

Classifications

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W40/735 Primary

  by melting or evaporation of solids · CPC title

• F28F2013/006

  Heat conductive materials · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• H01L2924/00

  Electricity · mapped topic