Copper alloy wire, copper alloy stranded wire, covered electric wire, and terminal-fitted electric wire
US-2015371726-A1 · Dec 24, 2015 · US
US9514856B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9514856-B2 |
| Application number | US-201114127724-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 4, 2011 |
| Priority date | Aug 4, 2011 |
| Publication date | Dec 6, 2016 |
| Grant date | Dec 6, 2016 |
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Disclosed is a copper alloy containing 1.0% to 3.6% of Ni, 0.2% to 1.0% of Si, 0.05% to 3.0% of Sn, 0.05% to 3.0% of Zn, with the remainder including copper and inevitable impurities. The copper alloy has an average grain size of 25 μm or less and has a texture having an average area percentage of cube orientation of 20% to 60% and an average total area percentage of brass orientation, S orientation and copper orientation of 20% to 50%. The copper alloy has a KAM value of 0.8 to 3.0 and does not suffer from cracking even when subjected to U-bending. The copper alloy has excellent balance between strengths (particularly yield strength in a direction perpendicular to the rolling direction) and bending workability.
Opening claim text (preview).
The invention claimed is: 1. A copper alloy, comprising: by mass, Ni in a content of from 1.0% to 3.6%; Si in a content of from 0.2% to 1.0%; Sn in a content of from 0.05% to 3.0%; Zn in a content of from 0.05% to 3.0%; and copper, wherein: the copper alloy has an average grain size of 25 μm or less; the copper alloy comprises a texture having an average area percentage of cube orientation {001}<100> of from 20% to 60% and having an average total area percentage of specific three orientations of from 20% to 50% as measured by scanning electron microscope-electron back-scattering pattern analysis (SEM-EBSP) with the three orientations being brass orientation {011}<211>, S orientation {123}<634>, and copper orientation {112}<111>; and the copper alloy has a kernel average misorientation (KAM) value of from 1.00 to 3.00. 2. The copper alloy of claim 1 , further comprising at least one element selected from the group consisting of Fe, Mn, Mg, Co, Ti, Cr, and Zr in a total content of from 0.01% to 3.0% by mass. 3. The copper alloy of claim 1 , wherein the copper alloy has an average total area percentage of the three orientations of from greater than 40% to 50%. 4. The copper alloy of claim 2 , wherein the copper alloy has an average total area percentage of the three orientations of from greater than 40% to 50%. 5. The copper alloy of claim 1 , wherein the copper alloy has an average grain size of 15 μm or less. 6. The copper alloy of claim 1 , wherein the copper alloy has an average area percentage of cube orientation {001}<100> of from 30% to 50%. 7. The copper alloy of claim 1 , wherein the copper alloy comprises Zn in a content of from 0.05% to 1.5% by mass. 8. The copper alloy of claim 1 , wherein the copper alloy comprises Sn in a content of from 0.1% to 1.0% by mass.
Alloys based on copper · CPC title
of copper or alloys based thereon · CPC title
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title
Alloys containing non-metals (C22C1/05, C22C1/08 take precedence) · CPC title
with nickel or cobalt as the next major constituent · CPC title
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