Copper alloy

US9514856B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9514856-B2
Application numberUS-201114127724-A
CountryUS
Kind codeB2
Filing dateAug 4, 2011
Priority dateAug 4, 2011
Publication dateDec 6, 2016
Grant dateDec 6, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed is a copper alloy containing 1.0% to 3.6% of Ni, 0.2% to 1.0% of Si, 0.05% to 3.0% of Sn, 0.05% to 3.0% of Zn, with the remainder including copper and inevitable impurities. The copper alloy has an average grain size of 25 μm or less and has a texture having an average area percentage of cube orientation of 20% to 60% and an average total area percentage of brass orientation, S orientation and copper orientation of 20% to 50%. The copper alloy has a KAM value of 0.8 to 3.0 and does not suffer from cracking even when subjected to U-bending. The copper alloy has excellent balance between strengths (particularly yield strength in a direction perpendicular to the rolling direction) and bending workability.

First claim

Opening claim text (preview).

The invention claimed is: 1. A copper alloy, comprising: by mass, Ni in a content of from 1.0% to 3.6%; Si in a content of from 0.2% to 1.0%; Sn in a content of from 0.05% to 3.0%; Zn in a content of from 0.05% to 3.0%; and copper, wherein: the copper alloy has an average grain size of 25 μm or less; the copper alloy comprises a texture having an average area percentage of cube orientation {001}<100> of from 20% to 60% and having an average total area percentage of specific three orientations of from 20% to 50% as measured by scanning electron microscope-electron back-scattering pattern analysis (SEM-EBSP) with the three orientations being brass orientation {011}<211>, S orientation {123}<634>, and copper orientation {112}<111>; and the copper alloy has a kernel average misorientation (KAM) value of from 1.00 to 3.00. 2. The copper alloy of claim 1 , further comprising at least one element selected from the group consisting of Fe, Mn, Mg, Co, Ti, Cr, and Zr in a total content of from 0.01% to 3.0% by mass. 3. The copper alloy of claim 1 , wherein the copper alloy has an average total area percentage of the three orientations of from greater than 40% to 50%. 4. The copper alloy of claim 2 , wherein the copper alloy has an average total area percentage of the three orientations of from greater than 40% to 50%. 5. The copper alloy of claim 1 , wherein the copper alloy has an average grain size of 15 μm or less. 6. The copper alloy of claim 1 , wherein the copper alloy has an average area percentage of cube orientation {001}<100> of from 30% to 50%. 7. The copper alloy of claim 1 , wherein the copper alloy comprises Zn in a content of from 0.05% to 1.5% by mass. 8. The copper alloy of claim 1 , wherein the copper alloy comprises Sn in a content of from 0.1% to 1.0% by mass.

Assignees

Inventors

Classifications

  • Alloys based on copper · CPC title

  • of copper or alloys based thereon · CPC title

  • Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title

  • Alloys containing non-metals (C22C1/05, C22C1/08 take precedence) · CPC title

  • with nickel or cobalt as the next major constituent · CPC title

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What does patent US9514856B2 cover?
Disclosed is a copper alloy containing 1.0% to 3.6% of Ni, 0.2% to 1.0% of Si, 0.05% to 3.0% of Sn, 0.05% to 3.0% of Zn, with the remainder including copper and inevitable impurities. The copper alloy has an average grain size of 25 μm or less and has a texture having an average area percentage of cube orientation of 20% to 60% and an average total area percentage of brass orientation, S orient…
Who is the assignee on this patent?
Shishido Hisao, Aruga Yasuhiro, Katsura Shinya, and 2 more
What technology area does this patent fall under?
Primary CPC classification H01B1/026. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).