Multi-layer micro-wire structure

Patent metadata

Field	Value
Publication number	US-9513759-B2
Application number	US-201414217544-A
Country	US
Kind code	B2
Filing date	Mar 18, 2014
Priority date	Sep 11, 2013
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A multi-layer micro-wire structure includes first and second substrates having first and second layers extending to first and second layer edges, respectively. The first layer includes first micro-wire electrodes and first connection pads. Each first micro-wire electrode includes one or more electrically connected first micro-wires and each first connection pad electrically connects to a corresponding first micro-wire electrode. The second layer includes second micro-wire electrodes and second connection pads. Each second micro-wire electrode includes one or more electrically connected second micro-wires, and each second connection pad electrically connects to a corresponding second micro-wire electrode. The second layer is located between the first substrate and the second substrate and the second layer edge extends at least partly beyond the first layer edge so that one or more of the second connection pads is located between at least a portion of the first layer edge and the second layer edge.

First claim

The invention claimed is:

1. A multi-layer micro-wire structure, comprising:
a first substrate and a first layer in contact with the first substrate, the first layer extending to a first layer edge and including one or more first micro-wire electrodes and one or more first connection pads, each first micro-wire electrode including one or more electrically connected first micro-wires, and each first connection pad electrically connected to a corresponding first micro-wire electrode;
a second substrate and a second layer in contact with the second substrate, the second layer extending to a second layer edge and including one or more second micro-wire electrodes and one or more second connection pads, each second micro-wire electrode including one or more electrically connected second micro-wires, and each second connection pad electrically connected to a corresponding second micro-wire electrode; and
wherein the second layer is located between the first substrate and the second substrate and wherein the second layer edge extends at least partly beyond the first layer edge so that one or more of the second connection pads is located between at least a portion of the first layer edge and the second layer edge.

2. The multi-layer micro-wire structure of claim 1 , wherein the second substrate is a substrate or cover of a display device.

3. The multi-layer micro-wire structure of claim 1 , wherein the first substrate and the second substrate include common materials and have a common thickness.

4. The multi-layer micro-wire structure of claim 1 , wherein the first micro-wires are arranged in a first pattern and the second micro-wires are arranged in a second pattern.

5. The multi-layer micro-wire structure of claim 4 , wherein the first substrate has a surface and wherein the second pattern is the same as the first pattern and is spatially out of phase with the first pattern in a direction parallel to the first substrate surface.

6. The multi-layer micro-wire structure of claim 1 , wherein the second substrate has a surface opposite the second micro-wires that is a touch surface of a capacitive touch screen.

7. The multi-layer micro-wire structure of claim 1 , further including a protective layer located on a side of the first micro-wires opposite the first substrate, the protective layer having a touch surface located on a side of the protective layer opposite the first micro-wires.

8. The multi-layer micro-wire structure of claim 1 , wherein the first micro-wires are located in micro-channels formed in the first layer or the second micro-wires are located in micro-channels formed in the second layer.

9. The multi-layer micro-wire structure of claim 1 , wherein the first micro-wires extend only partially through the first layer or the second micro-wires extend only partially through the second layer.

10. The multi-layer micro-wire structure of claim 1 , wherein the first micro-wires are located on the first layer or form the first layer or the second micro-wires are located on the second layer or form the second layer.

11. The multi-layer micro-wire structure of claim 1 , wherein the first layer or the second layer is a cured layer.

12. The multi-layer micro-wire structure of claim 1 , wherein the first micro-wires or the second micro-wires are cured micro-wires having sintered conductive particles, are plated micro-wires plated on a seed layer, silver halide micro-wires, or are dried conductive ink micro-wires.

13. The multi-layer micro-wire structure of claim 1 , wherein the first and second connection pads are arranged in separate rows.

14. The multi-layer micro-wire structure of claim 1 , wherein the first and second connection pads are arranged in a common row.

15. The multi-layer micro-wire structure of claim 1 , wherein the first layer edge is crenellated.

16. The multi-layer micro-wire structure of claim 1 , wherein the first substrate has a first substrate edge and the first layer edge coincides with the first substrate edge or the second substrate has a second substrate edge and the second layer edge coincides with the second substrate edge.

17. The multi-layer micro-wire structure of claim 1 , wherein the first layer edge is orthogonal to the second layer edge, the first connection pads are arranged adjacent to the first layer edge and the second connection pads are arranged adjacent to the second layer edge.

18. The multi-layer micro-wire structure of claim 1 , wherein the first substrate has an edge different from the first layer edge and the first connection pads are arranged along and adjacent to the first substrate edge or the second substrate has an edge different from the second layer edge and the second connection pads are arranged along and adjacent to the second substrate edge.

19. The multi-layer micro-wire structure of claim 1 , wherein the first micro-wires are sense micro-wires and the second micro-wires are drive micro-wires or wherein the second micro-wires are sense micro-wires and the first micro-wires are drive micro-wires.

20. A capacitive touch screen having the multi-layer micro-wire structure of claim 19 .

Assignees

• Eastman Kodak Co

Inventors

• Cok Ronald Steven

Classifications

• H10D64/205

  Nanosized electrodes, e.g. nanowire electrodes · CPC title

• H10H20/833

  Transparent materials · CPC title

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title

• G06F3/047 Primary

  using sets of wires, e.g. crossed wires · CPC title

• H05K1/0298

  Multilayer circuits · CPC title