Charge sharing testing of through-body-vias

Patent metadata

Field	Value
Publication number	US-9513330-B2
Application number	US-201213977659-A
Country	US
Kind code	B2
Filing date	Jun 29, 2012
Priority date	Jun 29, 2012
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

In accordance with one aspect of the present description, an integrated circuit die has a plurality of through-body-vias and a testing circuit on board the die which allows charges on a first and second through-body-via to redistribute between them to provide an indication whether one or both of the first and second through-body-vias has a defect. Other aspects are described.

First claim

What is claimed is:

1. A method, comprising:
setting a voltage level of a first through-body-via to a first voltage level;
setting a voltage level of a second through-body-via to a second voltage level lower than the first voltage level;
allowing charges on the first and second through-body-vias to redistribute between them to provide a common, third voltage level on the first and second through-body-vias, said third voltage level being between the first and second voltage levels and a function of the respective capacitances of the first and second through-body-vias; and
determining whether the one or both of the first and second through-body-vias has a defect as a function of the common, third voltage level wherein the determining includes comparing the common, third voltage level to a first threshold level lower than the first voltage level, and comparing the common, third voltage level to a second threshold level higher than the second voltage level, wherein said second threshold level is higher than said first threshold level.

2. The method of claim 1 wherein the allowing charges to redistribute includes electrically coupling the first and second through-body-vias together so that the first through-body-via discharges and second through-body-via charges to the common, third voltage level between the first and second voltage levels.

3. The method of claim 1 wherein the common, third voltage level being intermediate between the first and second threshold levels indicates one of a) both through-body-vias having an open condition defect and b) neither through-body-via having an open condition defect.

4. The method of claim 1 wherein the common, third voltage level being lower than the first threshold level indicates the first through-body-via has an open condition defect.

5. The method of claim 1 wherein the common, third voltage level being higher than the second threshold level indicates the second through-body-via has an open condition defect.

6. The method of claim 1 further comprising:
setting a voltage level of a first node having a through-body-via;
setting a voltage level of a second node having a replica of an open condition defect;
allowing charges on the first and second nodes to redistribute between them to provide a common voltage level on the first and second nodes; and
determining whether the first node has an open condition defect as a function of the common voltage level of the first and second nodes.

7. The method of claim 1 , further comprising:
setting a voltage level of a first through-body-via of a first plurality of pairs of through-body-vias, to the first voltage level;
setting a voltage level of a second through-body-via of the first plurality of pairs of through-body-vias, to the second voltage level lower than the first voltage level;
allowing charges on the first and second through-body-vias of each pair of the first plurality of pairs to redistribute between them to provide a common voltage level on each pair of the first and second through-body-vias, said common voltage level being between the first and second voltage levels;
determining whether the one or both of the first and second through-body-vias of each pair has an open condition defect as a function of the common voltage level of each pair;
rearranging the through-body-vias of the first plurality of pairs into a second plurality of pairs different from the first plurality of pairs;
setting a voltage level of a first through-body-via of the second plurality of pairs of through-body-vias, to the first voltage level;
setting a voltage level of a second through-body-via of the second plurality of pairs of through-body-vias, to the second voltage level lower than the first voltage level;
allowing charges on the first and second through-body-vias of each pair of the second plurality of pairs to redistribute between them to provide a common voltage level on each pair of the first and second through-body-vias of the second plurality of pairs, said common voltage level being between the first and second voltage levels;
determining whether one or both of the first and second through-body-vias of each pair of the second plurality of pairs has an open condition defect as a function of the common voltage level of each pair of the second plurality of pairs;
setting a voltage level of a first node of a first pair of nodes in which the first node has a through-body-via;
setting a voltage level of a second node of the pair of nodes in which the second node has a replica of an open condition defect;
allowing charges on the first and second nodes to redistribute between them to provide a common voltage level on the first and second nodes; and
determining whether the first node has an open condition defect as a function of the common voltage level of the first and second nodes, to provide a first node result indicating whether the first node has an open condition defect;
wherein a pair of through-body-vias of the second plurality of pairs includes the first node having a through-body-via and a second through-body-via wherein the determining whether the second through-body-via of the pair of the second plurality of pairs has an open condition defect as a function of the common voltage level of the pair of the second plurality of pairs is also a function of the first node result indicating whether the first node has an open condition defect.

8. A device, comprising:
an integrated circuit die, comprising:
a plurality of integrated circuit portions;
a plurality of through-body-vias; and
a testing circuit on board the die and adapted to:
set a voltage level of a first through-body-via of said plurality of through-body-vias to a first voltage level;
set a voltage level of a second through-body-via of said plurality of through-body-vias to a second voltage level lower than the first voltage level;
allow charges on the first and second through-body-vias to redistribute between them to provide a common, third voltage level on the first and second through-body-vias, said third voltage level being between the first and second voltage levels and a function of the respective capacitances of the first and second through-body-vias; and
provide result data indicating whether the one or both of the first and second through-body-vias has a defect as a function of the common, third voltage level;
wherein the testing circuit includes a comparator adapted to compare the common, third voltage level to a first threshold level lower than the first voltage level, and compare the common, third voltage level to a second threshold level higher than the second voltage level, wherein said second threshold level is higher than said first threshold level.

9. The device of claim 8 wherein the testing circuit has a switch adapted to allow charges to redistribute by electrically coupling the first and second through-body-vias together so that the first through-body-via discharges and second through-body-via charges to the common, third voltage level between the first and second voltage levels.

10. The device of claim 8 wherein the comparator provides result data indicating in response to a common, third voltage level being intermediate between the first and second threshold levels, that one of a) both through-body-vias have an open condition defect and b) neither through-body-via has an open condition defect.

11. The device of claim 8 wherein the comparator provides result data indicating in response the common, third voltage level being lower than the first threshold level, that the first through-body-via has an open condition defect.

12. The device of claim 8 wherein the comparator provides result

Assignees

• Vukic Mladenko
• Kolluru Kalyan C
• Intel Corp

Inventors

• Vukic Mladenko
• Kolluru Kalyan C

Classifications

• H10P74/207

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title