Non-contact sensing module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9513144-B2
Application number	US-201514934408-A
Country	US
Kind code	B2
Filing date	Nov 6, 2015
Priority date	Jun 18, 2013
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A non-contact sensing module includes a coil printed circuit board in which a reference pattern coil may be formed at an upper surface and in which a sensing pattern coil may be formed at a lower surface and that has a mounting hole at the center, and a main printed circuit board that may be coupled to the mounting hole and that may be vertically disposed at an upper surface of the coil printed circuit board and that may be electrically connected to the reference pattern coil and the sensing pattern coil.

First claim

What is claimed is:

1. A non-contact sensing module, comprising:
a sensing unit in which a reference pattern coil is formed at an upper surface of a coil printed circuit board and in which a sensing pattern coil is formed at a lower surface of the coil printed circuit board; and
a signal processor formed in a main printed circuit board that is uprightly coupled to the coil printed circuit board wherein the signal processor processes a signal generated in the sensing unit,
wherein the reference pattern coil and the sensing pattern coil are independently connected to the main printed circuit board without interference from each other,
wherein a mounting hole is formed at a center of the coil printed circuit board,
wherein the reference pattern coil is wound in a predetermined number of times at the upper surface of the coil printed circuit board,
wherein a start tab of the reference pattern coil is disposed at an edge side of the upper surface of the coil printed circuit board,
wherein an end tab of the reference pattern coil is supported by both surfaces of the coil printed circuit board by passing through the mounting hole,
wherein the sensing pattern coil is wound in a predetermined number of times at the lower surface of the coil printed circuit board,
wherein a start tab of the sensing pattern coil is disposed at an edge side of the lower surface of the coil printed circuit board, and
wherein an end tab of the sensing pattern coil is supported by both surfaces of the coil printed circuit board by passing through the mounting hole.

2. The non-contact sensing module of claim 1 , wherein the sensing unit includes
a first LC oscillation circuit connected to the reference pattern coil and oscillating a reference frequency signal of an inductance value of the reference pattern coil; and
a second LC oscillation circuit connected to the sensing pattern coil and oscillating a change frequency signal of an inductance value changing according to a displacement between the sensing pattern coil and a sensing object.

3. The non-contact sensing module of claim 2 , wherein the signal processor includes:
an integral circuit processing the reference frequency signal oscillated in the first LC oscillation circuit and the change frequency signal oscillated in the second LC oscillation circuit as a time function;
a comparator comparing respective processing values processed in the integral circuit; and
an output circuit determining a comparison result in the comparator and outputting a switching signal to a peripheral device interlocking with the sensing object.

4. The non-contact sensing module of claim 1 , further including a brake switch sensing a displacement of a brake pedal and outputting a switching signal to a peripheral device of a vehicle.

Assignees

• Hyundai Motor Co Ltd
• Dh Holdings Co Ltd

Inventors

• Kum Myung-Sub
• Noh Jong-Sang
• Lee Jung-Min

Classifications

• H03K17/9505

  Constructional details · CPC title

• Y10T29/49126

  Assembling bases · CPC title

• G01D5/22 Primary

  differentially influencing two coils · CPC title

• H03K17/9502 Primary

  Measures for increasing reliability · CPC title

• H03K17/9545

  with variable frequency · CPC title