LED module

Patent metadata

Field	Value
Publication number	US-9512968-B2
Application number	US-201314397870-A
Country	US
Kind code	B2
Filing date	May 10, 2013
Priority date	May 11, 2012
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

Provided is an LED module that can be easily manufactured while maintaining good reflective characteristics even when a plurality of LED elements and other electronic components are packaged on a circuit substrate. This LED module is characterized by having: a sub-mounting substrate for packaging a plurality of LED elements; a module substrate for packaging an electronic component other than the plurality of LED elements, the sub-mounting substrate being mounted on the module substrate; a dam material disposed on the module substrate and surrounding a mounting part of the sub-mounting substrate; and a cover member for covering top faces of the plurality of LED elements, the cover member being filled into an inside region of the dam material; the reflectance of a surface of the sub-mounting substrate being set higher than the reflectance of a surface of the module substrate.

First claim

What is claimed is:

1. An LED module containing a plurality of LED elements, comprising:
a submount substrate for mounting said plurality of LED elements;
a module substrate, which has a planate upper surface, for mounting said submount substrate and for also mounting other electronic components than said plurality of LED elements;
a dam member which is disposed on said module substrate so as to surround a mounting area where said submount substrate is mounted;
a covering material which is filled into an area inside said dam member so as to cover upper faces of said plurality of LED elements;
a wiring pattern which is disposed within said dam member and on said module substrate; and
a wire which connects a part of said plurality of LED elements mounted on said submount substrate to said wiring pattern disposed on a lower position comparing to said submount substrate, wherein
said dam member is spaced a certain distance away from an outer periphery of said submount substrate,
said module substrate has an area which is disposed around said submount substrate and directly covered by said covering material, and
the reflectance of a surface of said submount substrate is set higher than the reflectance of a surface of said area of said module substrate.

2. The LED module according to claim 1 , wherein said submount substrate and said module substrate are circular plates, respectively.

3. The LED module according to claim 2 , wherein said dam member is constructed by forming a strip of uniform width in the shape of a ring.

4. The LED module according to claim 1 , wherein a wiring pattern on said module substrate is connected by a wire to a wiring pattern on said submount substrate or to said plurality of LED elements.

5. The LED module according to claim 1 , wherein said submount substrate has a surface comprising an enhanced reflective film formed on a metal surface or a surface formed from a white ceramic material, and said module substrate is a metal substrate comprising a metal base and an insulating layer.

6. The LED module according to claim 5 , wherein said submount substrate is mounted on said insulating layer.

7. The LED module according to claim 5 , wherein said insulating layer has an opening, and wherein said submount substrate is mounted inside said opening and is connected directly to said metal base of said module.

8. The LED module according to claim 1 , further comprising a housing which holds an outer rim of said module substrate.

9. An LED module containing a plurality of LED elements, comprising:
a submount substrate for mounting said plurality of LED elements;
a module substrate, which has a planate upper surface, for mounting said submount substrate and for also mounting other electronic components than said plurality of LED elements;
a plurality of covering materials, each of which covers an upper face and a side face of each of said plurality of LED elements, and
a wiring pattern which is disposed on said module substrate, wherein
said module substrate has an area which is disposed around said submount substrate and is not covered by said covering material,
the reflectance of a surface of said submount substrate is set higher than the reflectance of a surface of said area of said module substrate,
each of said plurality of LED elements has an electrode face with two protruding electrodes formed thereon,
each of said plurality of covering materials is a phosphor layer, and
said protruding electrodes are connected to said wiring pattern.

10. The LED module according to claim 9 , wherein said submount substrate has a surface comprising an enhanced reflective film formed on a metal surface or a surface formed from a white ceramic material, and said module substrate is a metal substrate comprising a metal base and an insulating layer.

11. The LED module according to claim 10 , wherein said submount substrate is mounted on said insulating layer.

12. The LED module according to claim 10 , wherein said insulating layer has an opening, and wherein said submount substrate is mounted inside said opening and is connected directly to said metal base of said module substrate.

13. The LED module according to claim 9 , wherein said wiring pattern on said module substrate and a wiring pattern on said submount substrate are connected to each other by an elastic metal member.

14. The LED module according to claim 9 , wherein said submount substrate and said module substrate are circular plates, respectively.

Assignees

• Citizen Holdings Co Ltd
• Citizen Electronics

Inventors

• Tamura Ryo
• Akiyama Takashi

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10H20/856

  Reflecting means · CPC title

• H01L2924/00014

  Electricity · mapped topic