Removal of inorganic deposition from high temperature formations with non-corrosive acidic pH fluids

US9512348B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9512348-B2
Application numberUS-201313852710-A
CountryUS
Kind codeB2
Filing dateMar 28, 2013
Priority dateMar 28, 2013
Publication dateDec 6, 2016
Grant dateDec 6, 2016

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A method of servicing a wellbore in a subterranean formation comprising preparing a wellbore servicing fluid comprising an amino multicarboxylic acid chelating agent, a pH adjusting compound, and an aqueous base fluid, and contacting the wellbore servicing fluid with scale deposits on a surface in fluid communication with the wellbore and/or subterranean formation.

First claim

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What is claimed is: 1. A method of servicing a wellbore in a subterranean formation comprising: preparing a wellbore servicing fluid comprising an amino multicarboxylic acid chelating agent, a pH adjusting compound, a silica scale polymerization inhibitor, and an aqueous base fluid, wherein the wellbore servicing fluid does not comprise hydrogen fluoride; and contacting scale deposits on a surface in fluid communication with the wellbore and/or subterranean formation with the wellbore servicing fluid, wherein the scale deposits comprise silica, wherein the silica scale polymerization inhibitor is selected from the group consisting of: a polyaminoamide dendrimer, a polyethyleneimine, a poly(diallyldiamethylammonium chloride), any copolymer thereof, and any combination thereof, and wherein the amino multicarboxylic acid chelating agent is selected from the group consisting of: an amino polyether multicarboxylic acid; N-tris[2-(1,2-dicarboxyethoxy)ethyl]amine characterized by Structure I (TCA); N-bis[2-(carboxy-methoxy)ethyl]glycine characterized by Structure II (BCA3); N-bis[2-(1,2-dicarboxy-ethoxy)ethyl]glycine characterized by Structure III (BCA5); N-bis[2-(1,2-dicarboxy-ethoxy)ethyl]aspartic acid—characterized by Structure IV (BCA6); N-bis[2-(methyl-carboxymethoxy)ethyl]glycine characterized by Structure V (MBCA3); N-bis[2-(1,2-dicarboxyethoxy)ethyl]methylglycine characterized by Structure VI (MBCA5); and any combination thereof: 2. The method of claim 1 wherein the amino multicarboxylic acid chelating agent comprises an amino multicarboxylic acid that (i) has pK a values greater than about 1; and (ii) at least two carboxylic acid groups in the anionic carboxylate form (—COO − ) at pH values less than about 6. 3. The method of claim 1 wherein the amino polyether multicarboxylic acid comprises an amino polyether compound characterized by Structure VII comprising one nitrogen atom and at least 5 chelation sites: wherein A and B can each independently be a carboxylic acid containing moiety, —CH 2 —COOH, or combinations thereof, wherein n is a number from 1 to 10 and m is a number from 1 to 6. 4. The method of claim 1 wherein the amino multicarboxylic acid chelating agent is present in the wellbore servicing fluid in an amount of from about 1 wt. % to about 50 wt. %, based on the total weight of the wellbore servicing fluid. 5. The method of claim 1 wherein the pH adjusting compound comprises an acid selected from the group consisting of: hydrochloric acid, sulphuric acid, sulfamic acid; an acidic anhydride, formic acid, acetic acid, monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, a sulfinic acid, a sulfonic acid, methanesulfonic acid, p-toluenesulfonic acid, lactic acid, glycolic acid, oxalic acid, propionic acid, butyric acid; and any combination thereof. 6. The method of claim 1 wherein the pH adjusting compound comprises hydrochloric acid. 7. The method of claim 1 wherein the aqueous base fluid comprises a brine. 8. The method of claim 7 wherein the brine is present in the wellbore servicing fluid in an amount of from about 1 wt. % to about 20 wt. %, based on the total weight of the wellbore servicing fluid. 9. The method of claim 7 wherein the brine comprises the balance of the wellbore servicing fluid after considering the amount of the other components used. 10. The method of claim 1 wherein the wellbore servicing fluid has a pH of from about 0 to about 8. 11. The method of claim 1 wherein the wellbore servicing fluid comprises at least one additive selected from the group consisting of: a corrosion inhibitor, a surfactant, and any combination thereof. 12. The method of claim 1 wherein the wellbore servicing fluid is an acidizing fluid. 13. The method of claim 1 wherein the wellbore has a bottom hole temperature in the range of from about 200° F. to about 400° F. 14. The method of claim 1 wherein the wellbore comprises a high temperature well, a steam assisted gravity drainage well, a steam injector well, and/or a geothermal well. 15. The method of claim 1 wherein the surface in fluid communication with the wellbore and/or subterranean formation comprises a geological surface and/or a surface of equipment selected from the group consisting of: a heating turbine, a heat exchanger, a safety valve, a casing, a production tubing, a mandrel, a pipe, a separator, a pump, a tubular, a vessel, a completion equipment, a screen, a downhole tool, and any combination thereof. 16. The method of claim 1 wherein the scale deposit comprises less than about 80 wt. % silica, based on the total weight of the scale deposit. 17. The method of claim 16 wherein the scale further comprises transition metal precipitates, iron precipitates, copper precipitates, and combinations thereof. 18. A method of servicing a wellbore in a subterranean formation comprising: preparing a wellbore servicing fluid comprising an amino multicarboxylic acid chelating agent, a pH adjusting compound comprising hydrochloric acid, a silica scale polymerization inhibitor, and an aqueous base fluid, wherein the wellbore servicing fluid does not comprise hydrogen fluoride; and contacting scale deposits on a surface in fluid communication with the wellbore and/or subterranean formation with the wellbore servicing fluid, wherein the scale deposits comprise silica in an amount of less than about 80 wt. %, based on the total weight of the scale deposit, wherein the silica scale polymerization inhibitor is selected from the group consisting of: a polyaminoamide dendrimer, a polyethyleneimine, a poly(diallyldiamethylammonium chloride), any copolymer thereof, and any combination thereof, and wherein the amino multicarboxylic acid chelating agent is selected from the group consisting of: an amino polyether multicarboxylic acid; N-tris[2-(1,2-dicarboxyethoxy)ethyl]amine characterized by Structure I (TCA); N-bis[2-(carboxy-methoxy)ethyl]glycine characterized by Structure II (BCA3); N-bis[2-(1,2-dicarboxy-ethoxy)ethyl]glycine characterized by Structure III (BCA5); N-bis[2-(1,2-dicarboxy-ethoxy)ethyl]aspartic acid—characterized by Structure IV (BCA6); N-bis[2-(methyl-carboxymethoxy)ethyl]glycine characterized by Structure V (MBCA3); N-bis[2-(1,2-dicarboxyethoxy)ethyl]methylglycine characterized by Structure VI (MBCA5); and any combination thereof: 19. The method of claim 18 wherein the wellbore comprises a geothermal well with a bottom hole temperature in the range of from about 200° F. to about 400° F.

Assignees

Inventors

Classifications

  • C09K8/528Primary

    inorganic depositions, e.g. sulfates or carbonates · CPC title

  • combined with additives added for specific purposes · CPC title

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What does patent US9512348B2 cover?
A method of servicing a wellbore in a subterranean formation comprising preparing a wellbore servicing fluid comprising an amino multicarboxylic acid chelating agent, a pH adjusting compound, and an aqueous base fluid, and contacting the wellbore servicing fluid with scale deposits on a surface in fluid communication with the wellbore and/or subterranean formation.
Who is the assignee on this patent?
Halliburton Energy Services Inc
What technology area does this patent fall under?
Primary CPC classification C09K8/528. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).