Thermoplastic resin shaped-article, method of manufacturing the same, thermoplastic resin light guide, light source device, and liquid crystal display device
US-2015376359-A1 · Dec 31, 2015 · US
US9512285B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9512285-B2 |
| Application number | US-201314407471-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 6, 2013 |
| Priority date | Jun 12, 2012 |
| Publication date | Dec 6, 2016 |
| Grant date | Dec 6, 2016 |
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The present invention relates to a process comprising a step of heat treatment of a polyamide-based powder so as to reduce the difference between the initial crystal rearrangement temperature and the final crystal rearrangement temperature. The invention also relates to articles obtained by using powders that have undergone this treatment, in particular by selective melting of layers of polymer powder, in particular rapid prototyping by solid-phase sintering using a laser.
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The invention claimed is: 1. A process for the heat treatment of a (co)polyamide composition, comprising: heating to bring the composition to a temperature below the lowest melting point of the composition, Tfmin, and above the temperature Tfmin−30° C., for at least 10 minutes, cooling to room temperature, recovering the composition, wherein, before treatment and after treatment, the composition exhibits respective initial values of crystal rearrangement temperature, Tir, respective final values of crystal rearrangement temperature, Tfr, and respective values of the difference, Tfr−Tir, between Tfr and Tir, and wherein the value of the difference Tfr−Tir exhibited by the composition after treatment is decreased relative to the value of the difference Tfr−Tir exhibited by the composition before treatment, and wherein the composition comprises a total content of PA11 and of PA12 of less than or equal to 10% by weight relative to the total weight of (co)polyamide present in the composition. 2. The process as claimed in claim 1 , wherein during the heating step, the composition is brought to a temperature ranging from Tfmin−28° C. to Tfmin −2° C. 3. The process as claimed in claim 1 , wherein characterized in that the composition, heated to a maximum temperature equal to the softening point −2° C. 4. The process as claimed in claim 1 , wherein the composition comprises (co)polyamide(s) having several melting points with a temperature difference between the highest melting point and the lowest melting point of less than or equal to 15° C. 5. The process as claimed in claim 1 , wherein the composition obtained has a Tfr−Tir decreased by at least 15% relative to the value Tfr−Tir of the composition before treatment. 6. The process as claimed in claim 1 , wherein the composition comprises a content of (co)polyamide ranging from 50% to 100% by weight, relative to the total weight of the composition. 7. The process as claimed in claim 1 , wherein the composition comprises polyamides obtained by polycondensation of at least one linear aliphatic dicarboxylic acid with an aliphatic or cyclic diamine or between at least one aromatic dicarboxylic acid and an aliphatic or aromatic diamine, polyamides obtained by polycondensation of at least one amino acid or lactam with itself, or their blend and (co)polyamides. 8. The process as claimed in claim 1 , wherein the composition comprises at least one polyamide chosen from the following polyamides: PA 6.6, PA 6.10, PA 6.12, PA 10.10, PA 12.12, PA 4.6, MXD 6, PA, PA 6, PA 7, PA 9, PA 11, PA 12, PA 13, 6.6/6.T, PA 6.6/6 or a blend thereof and (co)polyamides thereof. 9. The process as claimed in claim 1 , wherein the composition comprises a content of (co)polyamide ranging from 50% to 100% by weight relative to the total weight of polyamide. 10. The process as claimed in claim 1 , wherein the composition comprises as polyamide only one or more (co)polyamides. 11. The process as claimed in claim 1 , wherein the composition comprises a (co)polyamide produced by polymerization of at least one constituent monomer of the polyamide and at least one or more comonomers. 12. The process as claimed in claim 1 , wherein the composition comprises a (co)polyamide chosen from (co)polyamides obtained by polycondensation: of at least one aliphatic dicarboxylic acid with an aliphatic or cyclic diamine or between at least one aromatic dicarboxylic acid and an aliphatic or aromatic diamine, or a blend thereof and (co)polyarnides thereof, of at least one amino acid or lactam with itself, it being possible for the amino acid to be generated by hydrolytic opening of a lactam ring, or a blend thereof and (co)polyamides thereof, of diacid, diamine and amino acid, mixtures thereof. 13. The process as claimed in claim 1 , wherein the composition comprises at least one (co)polyimide produced by polymerization of at least one lactam or amino acid constituent monomer of the polyainide and at least one comonomer represented by formula (1) below: R(Am) w −(Ac) x (OH) y (DA) z (1) in which: R is a linear; branched, aliphatic, aromatic or cycloaliphatic hydrocabon-based radical w is between 0 and 4; x is between 0 and 4; y is between 0 and 4; z is between 0 and 4; and w+x+y+z is greater than or equal to 1; Am is an amine functional group; Ac is a carboxylic acid functional group; and DA is a dicarboxylic acid functional group. 14. A (co)polyamide composition made by the process of claim 1 , wherein the composition is in powder form. 15. A process for manufacturing an article fashioned by selective melting of layers of a powder according to claim 14 . 16. An article made by the process of claim 15 . 17. The process of claim 1 , wherein the composition is in powder form. 18. The process of claim 2 , wherein the composition is brought to a temperature ranging from Tfmin −25° C. to Tfmin −5° C. during the heating step. 19. The process of claim 4 , wherein the temperature difference between the highest melting point and the lowest melting point is less than or equal to 10° C. 20. The process of claim 5 , wherein the composition after treatment has a Tfr−Tir that is at least 25° C. less than the value Tfr−Tir of the composition before treatment. 21. The process of claim 6 , wherein the composition comprises a content of (co)polyamide ranging from 60% to 100% by weight, relative to the total weight of the composition. 22. The process of claim 13 , wherein R further comprises heteroatoms.
Heat treatment · CPC title
Polyamides derived from polyamines and polycarboxylic acids (C08J2477/10 takes precedence) · CPC title
using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title
of synthetic resin · CPC title
Next to second layer of polyamide · CPC title
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