Seat assembly with temperature or humidity sensor

Patent metadata

Field	Value
Publication number	US-9511646-B2
Application number	US-201514629853-A
Country	US
Kind code	B2
Filing date	Feb 24, 2015
Priority date	Feb 25, 2014
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A sensor module for integration within a seat assembly is provided. The sensor module comprises a temperature and/or humidity sensor ( 21 ) and a separate sensor support ( 51 ) for mechanically supporting said temperature and/or humidity sensor. The sensor support is configured to be arranged on or in a support layer below an air-permeable cover of the seat assembly.

First claim

The invention claimed is:

1. A sensor module for integration within a seat assembly comprising a seat bottom and a backrest, at least one of the seat bottom and the backrest comprising a support layer and an air-permeable cover having an outside surface, which forms an occupant contact area of the seat assembly, and an inside surface, the sensor module comprising:
a combined temperature and humidity sensor; and
a separate sensor support for mechanically supporting the combined temperature and humidity sensor, the sensor support being configured to be arranged on or in the support layer below the air-permeable cover, wherein the combined temperature and humidity sensor comprises a semiconductor-based humidity sensor, the semiconductor-based humidity sensor comprising a semiconductor substrate and a polymer layer disposed on the semiconductor substrate, and wherein the polymer layer forms an active sensor surface.

2. The sensor module of claim 1 , wherein the sensor support defines a window that is fully surrounded by material of the sensor support, and wherein the active sensor surface is accessible for media through the window.

3. The sensor module of claim 2 , wherein the sensor module comprises an air-permeable protective membrane that covers the window.

4. The sensor module of claim 1 , wherein the sensor support includes a base portion having an essentially planar bottom surface configured to rest flat on the support layer.

5. The sensor module of claim 4 , wherein the base portion has a generally flat configuration.

6. The sensor module of claim 5 , wherein the base portion has a top surface configured to face away from the support layer towards the air-permeable cover, the entire top surface of the base portion being devoid of any prominent protrusions.

7. The sensor module of claim 6 ,
wherein the base portion has an outer rim, the top surface and the bottom surface meeting at the outer rim, and
wherein the top surface is domed, a distance between the top surface and the bottom surface of the base portion continuously decreasing towards the outer rim until the top surface and the bottom surface meet at the outer rim.

8. The sensor module of claim 4 , wherein the combined temperature and humidity sensor is mounted to the bottom surface of the base portion.

9. The sensor module of claim 4 , further comprising a connecting element for establishing an electrical connection with the combined temperature and humidity sensor, the connecting element comprising a flat, flexible printed circuit board,
wherein the combined temperature and humidity sensor and the connecting element are together mounted to the bottom surface of the base portion.

10. The sensor module of claim 9 ,
wherein the base portion has an outer rim,
wherein the sensor support includes one or more anchors configured to extend from the base portion into the support layer when the base portion rests flat on the support layer, the anchors extending along a longitudinal direction, and
wherein the connecting element extends beyond the outer rim of the base portion in a direction that is perpendicular to the longitudinal direction.

11. The sensor module of claim 9 , wherein the base portion has a notch, the notch receiving the combined temperature and humidity sensor and the connecting element.

12. The sensor module of claim 11 ,
wherein the base portion has an outer rim, and
wherein the notch is laterally open towards one side of the sensor support so as to allow the connecting element to extend beyond the outer rim of the base portion.

13. The sensor module of claim 9 , wherein the base portion, the combined temperature and humidity sensor, and the connecting element together form a planar bottom surface.

14. The sensor module of claim 4 , wherein the sensor module comprises an adhesive layer on the bottom surface of the base portion.

15. The sensor module of claim 14 , wherein the adhesive layer is covered by a peelable protective layer.

16. The sensor module of claim 4 , wherein the sensor support includes one or more anchors configured to extend from the base portion into the support layer when the base portion rests flat on the support layer.

17. The sensor module of claim 1 , wherein the sensor module has a top surface configured to face away from the support layer towards the air-permeable cover, the entire top surface being devoid of any prominent protrusions.

18. The sensor module of claim 17 , wherein the top surface is domed.

19. The sensor module of claim 1 wherein the sensor support comprises a main body and a sensor carrier, the sensor carrier carrying the combined temperature and humidity sensor and being connected to the main body via a slide-in connection and/or a latching connection.

20. The sensor module of claim 1 , wherein the sensor module comprises at least one of:
a connecting element for establishing an electrical connection with the combined temperature and humidity sensor; and
a microcontroller.

21. The sensor module of claim 1 , wherein the sensor module comprises a communication device for wireless communication with a remote control unit.

22. A seat assembly comprising a seat bottom and a backrest, at least one of the seat bottom and the backrest comprising:
a support layer,
an air-permeable cover having an outside surface, which forms an occupant contact area of the seat assembly, and an inside surface that is directed towards the support layer; and
a sensor module comprising a combined temperature and a separate sensor support for mechanically supporting the combined temperature and humidity sensor, the sensor support being configured to be arranged on or in the support layer below the air-permeable cover,
wherein the sensor module is disposed below the inside surface of the air-permeable cover, wherein the combined temperature and humidity sensor comprises a semiconductor-based humidity sensor, the semiconductor-based humidity sensor comprising a semiconductor substrate and a polymer layer disposed on the semiconductor substrate, and wherein the polymer layer forms an active sensor surface.

23. The seat assembly of claim 22 , wherein the combined temperature and humidity sensor is disposed at a distance of less than 25 mm below the outside surface of the air-permeable cover.

24. The seat assembly of claim 22 , wherein the sensor module is mounted in or on the support layer.

25. The seat assembly of claim 24 , wherein the support layer is a heating mat.

26. The seat assembly of claim 24 , wherein the support layer is resiliently compressible, and wherein the sensor module is mounted in or on a portion of the support layer that faces the air-permeable cover, the sensor module being mounted in such a manner that at least a portion of the sensor module that extends into the support layer is movable relative to the support layer when the support layer is resiliently compressed.

27. The seat assembly of claim 22 , wherein the support layer defines at least one pre-formed cavity that is open towards the air-permeable cover, and wherein at least part of the sensor module is disposed in the at least one pre-formed cavity.

28. The seat assembly of claim 22 , wherein the sensor module is enclosed in an air-permeable bag.

29. The seat assembly of claim 22 , further comprising at least one of a heating device, a cooling device and a ventil

Assignees

• Sensirion Ag

Inventors

• MüLLER CHRISTOPH
• Götze Michael
• Graf Markus

Classifications

• B60N2/56 Primary

  Heating or ventilating devices · CPC title

• G01N19/10

  Measuring moisture content, e.g. by measuring change in length of hygroscopic filament; Hygrometers · CPC title

• B60H1/00792 Primary

  Arrangement of detectors (B60H1/00742, B60H1/0075, B60H1/00785 take precedence) · CPC title

• B60N2/58

  Seat coverings · CPC title

• B60Y2400/89

  Cooling systems, e.g. fan drives · CPC title