Hot stamping machine

US9511620B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9511620-B2
Application numberUS-201314435785-A
CountryUS
Kind codeB2
Filing dateOct 22, 2013
Priority dateOct 24, 2012
Publication dateDec 6, 2016
Grant dateDec 6, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A hot-stamping device ( 1 ) is described, having a stamping device ( 2 ) for transferring a transfer layer ( 15 u ) disposed on a carrier layer ( 15 t ) of a hot-stamping foil ( 15 ) on to a substrate ( 14 ). The hot-stamping device comprises a heatable stamping roller ( 11 ) and a counter-pressure roller ( 12 ), between which a stamping gap ( 16 ) is realized, and comprising a separating device ( 3 ), disposed downstream, for separating the carrier layer ( 15 t ) from the transfer layer ( 15 u ) transferred on to the substrate ( 14 ). A flat support element ( 18 ) is disposed under the stamped substrate ( 17 ), between the stamping gap ( 16 ) and the separating device ( 3 ), directly adjoining the stamping gap ( 16 ) or at a distance of <1 mm from the stamping gap ( 16 ) or overlapping the stamping gap ( 16 ).

First claim

Opening claim text (preview).

The invention claimed is: 1. A hot-stamping device having a stamping device for transferring a transfer layer disposed on a carrier layer of a hot-stamping foil on to a flexible substrate, comprising a heatable stamping roller and a counter-pressure roller, between which a stamping gap is realized, and comprising a separating device, disposed downstream, for separating the carrier layer from the transfer layer transferred on to the substrate, wherein a flat support element for the stamped substrate is disposed under the stamped substrate, between the stamping gap and the separating device, directly adjoining the stamping gap or at a distance of <1 mm from the stamping gap or overlapping the stamping gap, wherein the support element is made of a material having a degree of hardness in the range of from 60° to 95° Shore A and/or a degree of hardness in the range of from 450 HV 10 (HV=Vickers hardness) to 520 HV 10. 2. A hot-stamping device according to claim 1 , wherein the support element is a rigid element, the maximum deflection of which, in the case of appropriate operational loading, is less than 10 μm. 3. A hot-stamping device according to claim 1 , wherein the support element is made of high-grade steel. 4. A hot-stamping device according to claim 1 , wherein the support element is made of silicone, coated rubber, paper, foil, or fiber-reinforced material. 5. A hot-stamping device according to claim 1 , wherein the support element is a support plate. 6. A hot-stamping device according to claim 5 , wherein the end portion of the support plate that faces towards the stamping gap is in the shape of a blade. 7. A hot-stamping device according to claim 1 , wherein the support element is a continuous belt. 8. A hot-stamping device according to claim 7 , wherein the belt is a seamless belt. 9. A hot-stamping device according to claim 8 , wherein the seamless belt has a thickness in the range of from 0.2 mm to 0.5 mm. 10. A hot-stamping device according to claim 7 , wherein the belt is a link belt of plate-type links, wherein adjacent links are connected to each other by a pivot joint, such that, when in the extended state, they form a gap-free support surface. 11. A hot-stamping device according to claim 1 , wherein the stamping roller has a coating of an elastomer having a thickness in the range of from 3 mm to 10 mm. 12. A hot-stamping device according to claim 11 , wherein the elastomer is silicone rubber. 13. A hot-stamping device according to claim 11 , wherein the coating has a degree of hardness in the range of from 60° to 95° Shore A. 14. A hot-stamping device according to claim 1 , wherein the support element is the end face of a sonotrode of an ultrasonic bearing apparatus. 15. A method for hot-stamping a transfer layer from a hot-stamping transfer foil onto a flexible carrier substrate, the method comprising: feeding a hot-stamping transfer foil together with a flexible carrier substrate to a stamping gap formed between a heated stamping roller and a counter-pressure roller; hot-stamping a transfer layer from the hot-stamping foil onto the flexible carrier substrate with the heated stamping roller to form a flexible stamped substrate; supporting the flexible stamped substrate leaving the stamping gap with a flat support element disposed downstream of the stamping gap by a distance of <1 mm; separating a carrier layer from the transfer layer of the hot-stamping foil in a separating device disposed downstream of the stamping gap, wherein the flat support element terminates at the separating device for supporting the flexible stamped substrate the entire distance between the stamping gap and the separating device.

Assignees

Inventors

Classifications

  • Attachments or auxiliary devices · CPC title

  • by rolling (B44B5/0061 takes precedence) · CPC title

  • Hot stamping techniques · CPC title

  • Dry transfer · CPC title

  • with means for applying print under heat and pressure, e.g. using heat activable adhesive · CPC title

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Frequently asked questions

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What does patent US9511620B2 cover?
A hot-stamping device ( 1 ) is described, having a stamping device ( 2 ) for transferring a transfer layer ( 15 u ) disposed on a carrier layer ( 15 t ) of a hot-stamping foil ( 15 ) on to a substrate ( 14 ). The hot-stamping device comprises a heatable stamping roller ( 11 ) and a counter-pressure roller ( 12 ), between which a stamping gap ( 16 ) is realized, and comprising a separating d…
Who is the assignee on this patent?
Leonhard Kurz Stiftung & Co Kg
What technology area does this patent fall under?
Primary CPC classification B44B5/028. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).