Driving mechanism
US-12165502-B2 · Dec 10, 2024 · US
Solid image pickup apparatus
US9509890B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9509890-B2 |
| Application number | US-201113032839-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 23, 2011 |
| Priority date | Feb 26, 2010 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A solid image pickup apparatus according to an embodiment includes: a device chip including a first principal surface and a second principal surface, a CMOS device and an electrode portion being formed on the first principal surface; a holding block including a joining surface joined to the second principal surface and an inclined surface inclined inward at a predetermined angle relative to the joining surface; a wiring board including a distal end portion including a connection portion connected to the electrode portion on the first principal surface, an extending portion that is in contact with the inclined surface, the extending portion being joined to the inclined surface via a bonding layer; and a flexure portion flexed at the predetermined angle between the distal end portion and the extending portion.
First claim
Opening claim text (preview).
What is claimed is: 1. A solid image pickup apparatus comprising: an image pickup device substrate including a first principal surface and a second principal surface, a solid image pickup device being formed on the first principal surface; a holding portion including a joining surface directly joined to the second principal surface of the image pickup device substrate, and an inclined surface inclined inward at a predetermined angle relative to the joining surface; and a wirin…
Assignees
Inventors
Classifications
- H04N23/54Primary
Electricity · mapped topic
- H04N5/2254Primary
Electricity · mapped topic
- A61B1/051Primary
Human Necessities · mapped topic
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Frequently asked questions
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- What does patent US9509890B2 cover?
- A solid image pickup apparatus according to an embodiment includes: a device chip including a first principal surface and a second principal surface, a CMOS device and an electrode portion being formed on the first principal surface; a holding block including a joining surface joined to the second principal surface and an inclined surface inclined inward at a predetermined angle relative to the…
- Who is the assignee on this patent?
- Nakayama Takashi, Olympus Corp
- What technology area does this patent fall under?
- Primary CPC classification H04N23/54. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).