Polymer composite piezoelectric body, electroacoustic transduction film, and electroacoustic transducer
US-2017373243-A1 · Dec 28, 2017 · US
US9508918B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9508918-B2 |
| Application number | US-201414492223-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 22, 2014 |
| Priority date | May 17, 2010 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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A piezoelectric device is manufactured in which the material of a supporting substrate can be selected from various alternative materials. Ions are implanted into a piezoelectric substrate to form an ion-implanted portion. A temporary supporting substrate is formed on the ion-implanted surface of the piezoelectric substrate. The temporary supporting substrate includes a layer to be etched and a temporary substrate. The piezoelectric substrate is then heated to be divided at the ion-implanted portion to form a piezoelectric thin film. A supporting substrate is then formed on the piezoelectric thin film. The supporting substrate includes a dielectric film and a base substrate. The temporary supporting substrate is made of a material that produces a thermal stress at the interface between the temporary supporting substrate and the piezoelectric thin film less than the thermal stress at the interface between the supporting substrate and the piezoelectric thin film.
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What is claimed is: 1. A method for manufacturing a composite piezoelectric substrate that includes a piezoelectric thin film supported by a supporting substrate, the method comprising: an ion implantation step of implanting an ionized element into a surface of a piezoelectric substrate to form a portion of the piezoelectric substrate having a peak concentration of the ionized element; a temporary supporting step of forming a temporary supporting substrate on a side of the ion-i…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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