Electronic components on trenched substrates and method of forming same

Patent metadata

Field	Value
Publication number	US-9508789-B2
Application number	US-201414157755-A
Country	US
Kind code	B2
Filing date	Jan 17, 2014
Priority date	Feb 27, 2007
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

An electronic module includes a substrate including at least one structure that reduces stress flow through the substrate, wherein the structure includes at least one trench in a surface of the substrate, and a plurality of capacitor legs disposed on an upper surface of the substrate.

First claim

What is claimed is:

1. An electronic module, comprising:
a substrate including at least one structure that reduces stress flow through the substrate, wherein said structure comprises at least one trench in a surface of the substrate; and
a plurality of capacitor legs disposed on an upper surface of the substrate;
wherein the at least one trench comprises a first trench formed around a first row of the capacitor legs.

2. The electronic module in accordance with claim 1 , wherein said at least one trench is formed around the plurality of capacitor legs, said capacitor legs mounting an electronic component to the substrate.

3. The electronic module in accordance with claim 1 , wherein said at least one trench further comprises
a second trench formed around a second row of the capacitor legs.

4. The electronic module in accordance with claim 1 , wherein said at least one trench comprises a continuous trench.

5. The electronic module in accordance with claim 1 , wherein a plurality of continuous trenches are formed around the plurality of capacitor legs.

6. The electronic module in accordance with claim 1 , wherein a plurality of individual trenches are formed around the plurality of capacitor legs.

7. The electronic module in accordance with claim 1 , wherein the surface comprises the upper surface of the substrate.

8. The electronic module in accordance with claim 1 , wherein the surface comprises a surface on which an electronic component is mounted.

9. The electronic module in accordance with claim 1 , wherein said at least one trench comprises a plurality of continuous trenches formed around the plurality of capacitor legs.

10. The electronic module in accordance with claim 1 , wherein said trench is formed in the upper surface of the substrate around each of the plurality of capacitor legs.

11. The electronic module in accordance with claim 1 , wherein the plurality of capacitor legs are soldering joints.

12. An electronic module, comprising:
a substrate;
an electronic component mounted above the substrate;
a plurality of capacitor legs disposed on an upper surface of the substrate, the plurality of capacitor legs mounting the electronic component above the substrate; and
at least one trench formed in the substrate around the plurality of capacitor legs.

13. The electronic module according to claim 12 , wherein the plurality of capacitor legs comprises a first row of capacitor legs and a second row of capacitor legs, and wherein the at least one trench comprises one of a plurality of trenches, the plurality of trenches comprising a first trench formed around the first row of capacitor legs and a second trench formed around a second row of capacitor legs.

14. The electronic module according to claim 12 , wherein the at least one trench comprises:
a first trench formed around a first row of the capacitor legs; and
a second trench formed around a second row of the capacitor legs.

15. The electronic module according to claim 12 , wherein said at least one trench comprises a plurality of individual trenches, said individual trenches being formed around the plurality of capacitor legs.

16. The electronic module in accordance with claim 12 , wherein the plurality of capacitor legs are soldering joints.

17. The electronic module in accordance with claim 12 , wherein the electronic component is mounted to an uppermost surface of the substrate.

18. An electronic module, comprising:
a substrate; and
at least one trench in a surface of the substrate, said at least one trench being formed around a plurality of capacitor legs disposed on an upper surface of the substrate, said capacitor legs mounting an electronic component to the substrate.

19. The electronic module in accordance with claim 18 , wherein the at least one trench comprises a plurality of trenches.

20. The electronic module in accordance with claim 18 , wherein plurality of capacitor legs are soldering joints.

Assignees

• Globalfoundries Inc

Inventors

• Questad David
• Khanna Vijayeshwar D
• Muncy Jennifer V
• Sharma Arun
• Sri-Jayantha Sri M
• Valdevit Lorenzo

Classifications

• Y10T428/24479

  including variation in thickness · CPC title

• H05K1/0231

  Capacitors or dielectric substances · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K1/0271

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title