Resin-encapsulated semiconductor device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9508684-B2
Application number	US-201615053267-A
Country	US
Kind code	B2
Filing date	Feb 25, 2016
Priority date	Mar 5, 2015
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

A first resin encapsulated body ( 25 ) and a second resin encapsulated body ( 26 ) are stacked to form a resin-encapsulated semiconductor device. The first resin encapsulated body ( 25 ) includes: a first semiconductor element ( 2 ); an external terminal ( 5 ); inner wiring ( 4 ); and a first resin ( 6 ) for covering those components, at least a rear surface of the external terminal ( 5 ), a rear surface of the semiconductor element ( 2 ), and a surface of the inner wiring ( 4 ) are exposed from the first resin ( 6 ). The second resin encapsulated body ( 26 ) includes: a second semiconductor element ( 7 ) having an electrode pad formed on a surface thereof; a second resin ( 8 ) for covering the second semiconductor element; and a metal body connected to the electrode pad, and is partly exposed from the second resin. The inner wiring and the metal body are electrically connected to each other.

First claim

What is claimed is:

1. A resin-encapsulated semiconductor device, comprising:
a first resin-encapsulated body; and
a second resin encapsulated body,
the first resin encapsulated body comprising:
a first semiconductor element;
an external terminal spaced around the first semiconductor element;
inner wiring for connecting the first semiconductor element and a surface of the external terminal to each other; and
a first resin for covering the first semiconductor element, th…

Assignees

• Sii Semiconductor Corp

Inventors

• Kimura Noriyuki

Classifications

• H10W74/00

  Electricity · mapped topic

• H10W74/142

  Electricity · mapped topic

• H10W72/073

  Electricity · mapped topic

• H10W72/0198

  Electricity · mapped topic

• H10W72/884

  Electricity · mapped topic