System, method and apparatus for RF power compensation in a plasma processing system

US9508529B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9508529-B2
Application numberUS-201414521776-A
CountryUS
Kind codeB2
Filing dateOct 23, 2014
Priority dateOct 23, 2014
Publication dateNov 29, 2016
Grant dateNov 29, 2016

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  2. Abstract

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  5. First independent claim

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Abstract

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Plasma processing systems and methods including a plasma processing chamber and an RF transmission path. The plasma processing chamber including an electrostatic chuck. The RF transmission path including one or more RF generators, a match circuit coupled the RF generator and an RF feed coupling the match circuit to the electrostatic chuck. The system also includes an RF return path coupled between the plasma processing chamber and the RF generator. A plasma processing system controller is coupled to the plasma processing chamber and the RF transmission path. The controller includes recipe logic for at least one plasma processing recipe including multiple plasma processing settings and an RF power compensation logic for adjusting at least one of the plasma processing settings.

First claim

Opening claim text (preview).

The invention claimed is: 1. A plasma processing system comprising: a plasma processing chamber including an electrostatic chuck; an RF transmission path including: at least one RF generator; a match circuit having an input coupled to an output of the at least one RF generator; and an RF feed coupling a match circuit output to an RF input to the electrostatic chuck; an RF return path coupled between the plasma processing chamber and the at least one RF generator; and a…

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What does patent US9508529B2 cover?
Plasma processing systems and methods including a plasma processing chamber and an RF transmission path. The plasma processing chamber including an electrostatic chuck. The RF transmission path including one or more RF generators, a match circuit coupled the RF generator and an RF feed coupling the match circuit to the electrostatic chuck. The system also includes an RF return path coupled betw…
Who is the assignee on this patent?
Lam Res Corp
What technology area does this patent fall under?
Primary CPC classification H01J37/32082. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).