High temperature electromagnetic coil assemblies

Patent metadata

Field	Value
Publication number	US-9508486-B2
Application number	US-201314035560-A
Country	US
Kind code	B2
Filing date	Sep 24, 2013
Priority date	Mar 2, 2011
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the high temperature electromagnetic coil assembly includes a coiled anodized aluminum wire and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded. The electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire.

First claim

What is claimed is:

1. A high temperature electromagnetic coil assembly, comprising:
a coiled anodized aluminum wire; and
an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded;
wherein the electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire.

2. The high temperature electromagnetic coil assembly of claim 1 wherein the electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion between about 16 and about 23 parts per million per degree Celsius.

3. The high temperature electromagnetic coil assembly of claim 1 further comprising a hermetically-sealed canister in which the coiled anodized aluminum wire and the electrically-insulative, high thermal expansion ceramic body are disposed.

4. The high temperature electromagnetic coil assembly of claim 3 further comprising a feedthrough mounted through wall of the hermetically-sealed canister and electrically coupled to the coiled anodized aluminum wire.

5. The high temperature electromagnetic coil assembly of claim 1 further comprising a support structure around with the coiled anodized aluminum wire is wound and over which the electrically-insulative, high thermal expansion ceramic body is formed.

6. The high temperature electromagnetic coil assembly of claim 5 wherein the support structure comprises a bobbin.

7. The high temperature electromagnetic coil assembly of claim 1 wherein the electrically-insulative, high thermal expansion ceramic body comprises an inorganic cement.

8. The high temperature electromagnetic coil assembly of claim 7 wherein the inorganic cement comprises a water-activated, silicate-based cement.

9. The high temperature electromagnetic coil assembly of claim 7 further comprising a sealant applied over an outer surface of the electrically-insulative, high thermal expansion ceramic body, the sealant selected from the group consisting of a low melt glass and a waterglass.

10. The high temperature electromagnetic coil assembly of claim 1 wherein the electrically-insulative, high thermal expansion ceramic body comprises a low melt glass having a melting point less than the melting point of the anodized aluminum wire.

11. The high temperature electromagnetic coil assembly of claim 10 wherein the electrically-insulative, high thermal expansion ceramic body further comprises a plurality of platelet-shaped particles dispersed throughout the low melt glass.

12. The high temperature electromagnetic coil assembly of claim 10 wherein the low melt glass comprises a leaded borosilicate glass.

13. A high temperature electromagnetic coil assembly, comprising:
a hermetically-sealed container;
an electrically-insulative, high thermal expansion ceramic body housed within the hermetically-sealed container; and
a coiled anodized aluminum wire embedded within the electrically-insulative, high thermal expansion ceramic body;
wherein the coefficient of thermal expansion of electrically-insulative, high thermal expansion ceramic body is substantially matched to the coefficient of thermal expansion of the coiled anodized aluminum wire embedded therein.

14. The high temperature electromagnetic coil assembly of claim 13 wherein the electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion between about 16 and about 23 parts per million per degree Celsius.

15. The high temperature electromagnetic coil assembly of claim 13 further comprising a support structure having a tubular body around with the coiled anodized aluminum wire is wound and over which the electrically-insulative, high thermal expansion ceramic body is formed.

16. The high temperature electromagnetic coil assembly of claim 15 wherein the electrically-insulative, high thermal expansion ceramic body is formed from a wet-state, inorganic cement applied and cured over the coiled anodized aluminum wire and the support structure.

17. The high temperature electromagnetic coil assembly according to claim 1 further comprising:
a tubular support structure around which coiled anodized aluminum wire is wound and over which the electrically-insulative, high thermal expansion ceramic body is formed;
an axial bore provided in the tubular support structure; and
a magnetically-permeable core slidably disposed within the axial bore, the magnetically-permeable core selected from the group consisting of the core of a solenoid and the core of a linear variable differential transformer.

18. A high temperature electromagnetic coil assembly, comprising:
a coiled anodized aluminum wire; and
an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded;
wherein the electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire; and
wherein the electrically-insulative, high thermal expansion ceramic body comprises a low melt glass having a melting point less than the melting point of the anodized aluminum wire.

19. The high temperature electromagnetic coil assembly of claim 18 wherein the electrically-insulative, high thermal expansion ceramic body further comprises a plurality of platelet-shaped particles dispersed throughout the low melt glass.

20. The high temperature electromagnetic coil assembly of claim 19 wherein the low melt glass comprises a leaded borosilicate glass.

Assignees

• Honeywell Int Inc

Inventors

• Piascik James
• Passman Eric
• Oboodi Reza
• Franconi Robert
• Fox Richard
• Seminara Gary J
• Holden Gene
• Harding Jacob

Classifications

• Y10T29/49073

  by assembling coil and core · CPC title

• H01F27/04

  Leading of conductors or axles through casings, e.g. for tap-changing arrangements · CPC title

• Y10T29/49071

  by winding or coiling · CPC title

• H01F5/06

  Insulation of windings · CPC title

• H01F21/06

  by movement of core or part of core relative to the windings as a whole · CPC title