Circuit package for connecting to an electro-photonic memory fabric
US-2024345316-A1 · Oct 17, 2024 · US
US9508412B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9508412-B2 |
| Application number | US-201514872382-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 1, 2015 |
| Priority date | Nov 20, 2012 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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A semiconductor memory apparatus includes a bank; a temperature sensor configured to generate a temperature voltage of which voltage level is changed according to a temperature variation of the bank; and a timing control block configured to control a timing of a signal to be inputted to the bank, according to the voltage level of the temperature voltage.
Opening claim text (preview).
What is claimed is: 1. A semiconductor comprising: a first circuit; a second circuit; a first temperature sensor configured to generate a first temperature voltage in response to a temperature of the first circuit; a second temperature sensor configured to generate a second temperature voltage in response to a temperature of the second circuit; a signal transfer block configured to output a signal to one of the first circuit and the second circuit in response to an circuit…
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