Photosensitive composition, protective film, and element having the protective film

Patent metadata

Field	Value
Publication number	US-9507261-B2
Application number	US-201514700157-A
Country	US
Kind code	B2
Filing date	Apr 30, 2015
Priority date	May 7, 2014
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

A photosensitive composition, a protective film, and an element having the protective film are provided. The photosensitive composition includes a polysiloxane (A), an o-naphthoquinonediazidesulfonate (B), and a solvent (C). The polysiloxane (A) is obtained by polycondensing a mixture, wherein the mixture includes a silane monomer (a-1) represented by formula (1), a silane monomer (a-2) represented by formula (2), and a silicon-containing compound (a-3). The silicon-containing compound (a-3) is selected from the group consisting of a silane monomer represented by formula (3), a siloxane prepolymer, and a silica particle. The photosensitive composition can be made into a protective film with excellent chemical resistance.

(R 1 O) 3 Si—R 2 —Si(OR 3 ) 3   formula (1)

Si(R 4 ) b (OR 5 ) 4−b   formula (2)

Si(R 6 ) c (OR 7 ) 4−c   formula (3)

First claim

What is claimed is:

1. A photosensitive composition, comprising:
a polysiloxane (A);
an o-naphthoquinonediazidesulfonate (B); and
a solvent (C),
wherein the polysiloxane (A) is obtained by polycondensing a mixture, wherein the mixture comprises a silane monomer (a-1) represented by formula (1), a silane monomer (a-2) represented by formula (2), and a silicon-containing compound (a-3),
(R 1 O) 3 Si—R 2 —Si(OR 3 ) 3   formula (1)

in formula (1), R 1 and R 3 each inde…

Assignees

• Chi Mei Corp

Inventors

• Huang Wei-Jie
• Shih Chun-An

Classifications

• C09D183/06 Primary

  Chemistry & Metallurgy · mapped topic

• G03F7/0757

  Physics · mapped topic

• C08G77/14

  Chemistry & Metallurgy · mapped topic

• G03F7/022 Primary

  Physics · mapped topic

• C08K5/42

  Chemistry & Metallurgy · mapped topic