Holding device, method of determining attraction abnormality in holding device, lithography apparatus, and method of manufacturing article
US-2024393682-A1 · Nov 28, 2024 · US
Imprint method, imprint apparatus, and process for producing chip
US9507256B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9507256-B2 |
| Application number | US-89445010-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 30, 2010 |
| Priority date | Oct 18, 2005 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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Abstract
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An imprint method for imprinting an imprint pattern of a mold onto a pattern formation material on a substrate so as to realize a high throughput includes the steps of bringing the imprint pattern and the pattern formation material into contact with each other; applying a first pressure between the mold and the substrate to increase a contact area between the imprint pattern and the pattern formation material; and adjusting a positional relationship between the mold and the substrate at a second pressure lower than the first pressure.
First claim
Opening claim text (preview).
What is claimed is: 1. An imprint apparatus for imprinting an imprint pattern of a mold onto a pattern formation material on a substrate, the imprint apparatus comprising: a mold holding portion for holding the mold; a substrate stage for mounting the substrate thereon; a pressure control portion for controlling pressure applied by the mold and the substrate to the pattern formation material on the substrate; a position adjusting portion for adjusting a positional relationsh…
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Operations & Transport · mapped topic
Operations & Transport · mapped topic
- G03F7/0002Primary
Physics · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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- What does patent US9507256B2 cover?
- An imprint method for imprinting an imprint pattern of a mold onto a pattern formation material on a substrate so as to realize a high throughput includes the steps of bringing the imprint pattern and the pattern formation material into contact with each other; applying a first pressure between the mold and the substrate to increase a contact area between the imprint pattern and the pattern for…
- Who is the assignee on this patent?
- Seki Junichi, Suehira Nobuhito, Canon Kk
- What technology area does this patent fall under?
- Primary CPC classification G03F7/0002. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).