Image exposure device, image exposure method, and program
US-2023185179-A1 · Jun 15, 2023 · US
Two-beam interference apparatus and two-beam interference exposure system
US9507248B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9507248-B2 |
| Application number | US-201213681744-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 20, 2012 |
| Priority date | Nov 29, 2011 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
A two-beam interference apparatus may include a wafer stage on which a wafer may be set, a beam splitter to split first laser light into second and third laser light having a beam intensity distribution elongated in a first direction within a surface of the wafer, and an optical system to guide the second and third laser light onto the wafer. The wafer is irradiated with the second laser light from a second direction perpendicular to the first direction, and the third laser light from a third direction perpendicular to the first direction but different from the second direction, to thereby cause interference of the second and third laser light on the wafer. This apparatus increases the accuracy of the two-beam interference exposure.
First claim
Opening claim text (preview).
What is claimed is: 1. A two-beam interference apparatus comprising: a wafer stage configured to receive a wafer to be set on the wafer stage; a beam splitter configured to split first laser light output from a laser device into second laser light and third laser light having a beam intensity distribution elongated in a first direction within a surface of the wafer; an optical system configured to guide the second laser light and the third laser light onto the wafer; a phase…
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Classifications
- G03B27/522Primary
Physics · mapped topic
- G03F7/70408Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US9507248B2 cover?
- A two-beam interference apparatus may include a wafer stage on which a wafer may be set, a beam splitter to split first laser light into second and third laser light having a beam intensity distribution elongated in a first direction within a surface of the wafer, and an optical system to guide the second and third laser light onto the wafer. The wafer is irradiated with the second laser light …
- Who is the assignee on this patent?
- Gigaphoton Inc
- What technology area does this patent fall under?
- Primary CPC classification G03B27/522. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).