Sensor tip and method of manufacturing the same
US-2024176032-A1 · May 30, 2024 · US
US9506876B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9506876-B2 |
| Application number | US-201214371427-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 12, 2012 |
| Priority date | Feb 6, 2012 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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The X-ray inspection device includes: an X-ray source with a focal spot size greater than the diameter of a defect for irradiating a sample with X-rays; an X-ray TDI detector arranged near the sample and having long pixels in a direction parallel to the scanning direction of the sample for detecting the X-rays emitted by the X-ray source and passing through the sample as an X-ray transmission image; and a defect-detecting unit for detecting defects based on the X-ray transmission image detected by the X-ray TDI detector.
Opening claim text (preview).
The invention claimed is: 1. An X-ray inspection device, comprising: an X-ray source irradiating X-rays on a sample; an X-ray Time Delay Integration (TDI) detector, for detecting X-rays irradiated by said X-ray source and transmitted through said sample as an X-ray transmission image, having a scintillator, an asymmetric fiber optic plate and a square-pixel TDI camera that, in combination, produce flat rectangular detector pixels that are longer in a direction parallel to a scanning direction of said sample, the X-ray TDI detector being arranged adjacent to said sample; and a defect detection part detecting defects on the basis of X-ray transmission images detected by means of said X-ray TDI detector. 2. The X-ray inspection device according to claim 1 , wherein: an amount of blurring of said X-ray transmission images is smaller than a size of the defects detected in said defect detection part. 3. The X-ray inspection device according to claim 1 , wherein: the distance between a focal spot of said X-ray source and said X-ray TDI detector is much longer than a distance between said sample and said X-ray TDI detector. 4. The X-ray inspection device according to claim 1 , wherein the X-ray source has a focal spot size greater than a defect diameter. 5. The X-ray inspection device according to claim 1 , wherein the fiber optic plate is tapered. 6. The X-ray inspection device according to claim 1 , wherein the TDI detector further comprises an aperture mask arranged on a top surface of the scintillator and an aperture mask arranged on a bottom surface of the scintillator, the resolution of the top and bottom surface masks being higher than the resolution of the scintillator. 7. An X-ray inspection method, comprising: irradiating X-rays on a sample using an X-ray source; detecting X-rays irradiated and transmitted through said sample as an X-ray transmission image using an X-ray TDI detector having a scintillator, an asymmetric fiber optic plate and a square-pixel TDI camera that, in combination, produce flat rectangular detector pixels that are longer in a direction parallel to the scanning direction of said sample, the TDI detector being arranged adjacent to said sample; and detecting defects on the basis of X-ray transmission images detected. 8. The X-ray inspection method according to claim 7 , wherein: an amount of blurring of said X-ray transmission images is smaller than a size of the detected defects. 9. The X-ray inspection method according to claim 7 , wherein: a distance between a focal spot of said X-ray source and said X-ray TDI detector is much longer than a distance between said sample and said X-ray TDI detector. 10. The X-ray inspection method according to claim 7 , wherein the X-ray source has a focal spot size greater than a defect diameter. 11. The X-ray inspection method according to claim 7 , wherein the fiber optic plate is tapered. 12. The X-ray inspection method according to claim 7 , wherein the TDI detector further comprises an aperture mask arranged on a top surface of the scintillator and an aperture mask arranged on a bottom surface of the scintillator, the resolution of the top and bottom surface masks being higher than the resolution of the scintillator.
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