Method of extracting properties of a layer on a wafer
US-2024234216-A9 · Jul 11, 2024 · US
US9506872B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9506872-B2 |
| Application number | US-201414204207-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 11, 2014 |
| Priority date | Sep 10, 2008 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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An inspection method and apparatus for detecting defects or haze of a sample, includes illuminating light to the sample from an oblique direction relative to a surface of the sample with an illuminator, detecting first scattered light at a forward position relative to an illuminating direction from the sample with a first detector, detecting second scattered light at a sideward or backward position relative to the illuminating direction from the sample with a second detection, and processing a first signal of the first scattered light and a second signal of the second scattered light with different weighting for the first signal and for the second signal with a processor.
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What is claimed is: 1. An inspection method for detecting defects or haze of a sample, comprising the steps of: illuminating light to the sample from an oblique direction relative to a surface of the sample; detecting first forward scattered light scattering toward a forward direction relative to an illuminating direction from the sample to generate a first signal; detecting second sideward or backward scattered light scattering toward a sideward or backward direction relative…
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