Micromechanical measuring element and method for producing a micromechanical measuring element

Patent metadata

Field	Value
Publication number	US-9506831-B2
Application number	US-201314383857-A
Country	US
Kind code	B2
Filing date	Mar 8, 2013
Priority date	Mar 9, 2012
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.

First claim

The invention claimed is:

1. A micromechanical measuring element, comprising:
a carrier;
a sensitive element connected to the carrier by a first solder connection and a second solder connection, wherein the sensitive element is electrically contacted by the first solder connection;
elastomer bodies arranged between the sensitive element and the first and second solder connections; and
a metallization arranged between the elastomer body and the first solder connection, wherein the metallization has a meandering or helical shape, and
wherein the sensitive element, the carrier and the second solder connection form a first chamber, the first chamber having a first opening.

2. The micromechanical measuring element according to claim 1 ,
wherein the sensitive element comprises a membrane with a bottom side and a top side, and
wherein the top side of the membrane is accessible to a first medium by the first opening.

3. The micromechanical measuring element according to claim 1 , wherein the first opening is realized in the carrier.

4. The micromechanical measuring element according to claim 1 , wherein the second solder connection is ring-shaped.

5. The micromechanical measuring element according to claim 1 , wherein the first chamber is provided at least in part with a protective layer.

6. The micromechanical measuring element according to claim 5 , wherein the protective layer comprises parylene.

7. The micromechanical measuring element according to claim 1 ,
wherein the sensitive element is connected directly to a substrate on a side that is remote from the carrier,
wherein a second chamber is formed at least in part by the sensitive element and the substrate, and
wherein the second chamber has a second opening that runs through the carrier and the sensitive element.

8. The micromechanical measuring element according to claim 7 ,
wherein the sensitive element comprises a membrane with a bottom side and a top side, and
wherein the top side of the membrane is accessible to a first medium by the first opening.

9. The micromechanical measuring element according to claim 8 , wherein the bottom side of the membrane is accessible to a second medium by way of the second opening.

10. The micromechanical measuring element according to claim 1 , wherein the measuring element comprises a pressure sensor.

11. The micromechanical measuring element according to claim 1 , wherein the measuring element comprises a gas sensor.

12. The micromechanical measuring element according to claim 1 , wherein the measuring element comprises an acceleration sensor.

13. A method for producing a micromechanical measuring element, the method comprising:
providing a sensitive element;
providing a carrier that has a first opening for supplying a medium and a feed through for electrically contacting the sensitive element;
providing elastomer bodies and arranging the elastomer bodies between the sensitive element and first and second solder connections; and
providing a metallization and arranging the metallization between the elastomer body and the first solder connection, wherein the metallization has a meandering or helical shape, and
connecting the sensitive element to the carrier, wherein the sensitive element is contacted electrically and media is supplied to the sensitive element in one process step by connecting the sensitive element to the carrier.

14. The method according to claim 13 , wherein connecting the sensitive element to the carrier comprises connecting the sensitive element to the carrier by flip-chip soldering.

15. A micromechanical measuring element comprising:
a carrier;
a sensitive element connected to the carrier by a first solder connection and a second solder connection, wherein the sensitive element is electrically contacted by the first solder connection;
elastomer bodies arranged between the sensitive element and the first and second solder connections; and
a metallization arranged between an elastomer body and the first solder connection, wherein the metallization comprises a meandering or helical shape, wherein the metallization is configured to decouple the carrier and the sensitive element to ensure that mechanical or thermal stress is minimized, and wherein the sensitive element, the carrier and the second solder connection form a first chamber, the first chamber having a first opening.

Assignees

• Epcos Ag

Inventors

• Schiffer Michael
• Peschka Andreas
• Zapf Jörg
• Weidner Karl
• Hedler Harry

Classifications

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• B23K1/0008

  specially adapted for particular articles or work · CPC title

• G01P1/023

  for acceleration measuring devices · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title