Circuit board and lighting device having the circuit board

Patent metadata

Field	Value
Publication number	US-9506637-B2
Application number	US-201414472075-A
Country	US
Kind code	B2
Filing date	Aug 28, 2014
Priority date	Oct 2, 2013
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

Provided is a circuit board including: a support substrate including a first region and a second region extending to be bent from the first region; light emitting devices mounted to the first region of the support substrate; and a bending portion bent between the first region and the second region, wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, wherein the interconnection line protection portion protrudes more than the interconnection line arrangement portion.

First claim

What is claimed is:

1. A circuit board, comprising:
a support substrate including a first region and a second region extending to be bent from the first region;
light emitting devices mounted to the first region of the support substrate; and
a bending portion bent between the first region and the second region,
wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, and
wherein the interconnection line protection portion comprises a dummy metal attached to the support substrate using an adhesive layer such that, in a first region not having the interconnection line passing therethrough, the interconnection line protection portion has an embossed structure that is protruded further than the interconnection line arrangement portion in the first region.

2. The circuit board of claim 1 , further comprising an insulating substrate formed on the support substrate, wherein the interconnection line protection portion protrudes to an upper part of the insulating substrate.

3. The circuit board of claim 1 , further comprising an insulating substrate formed on the support substrate, wherein the interconnection line protection portion is formed on the support substrate to come into contact with the insulating substrate, and the interconnection line arrangement portion is spaced apart from the insulating substrate.

4. The circuit board of claim 1 , wherein the interconnection line protection portion comprises at least two edges.

5. The circuit board of claim 1 , further comprising an insulating substrate formed on the support substrate, wherein the insulating substrate is formed at a protruding upper part of the interconnection line protection portion.

6. The circuit board of claim 1 , wherein the interconnection line protection portion has a curved surface.

7. The circuit board of claim 1 , wherein the interconnection line protection portion has a plurality of stepped parts.

8. The circuit board of claim 1 , wherein the interconnection line arrangement portion is formed of a bending hole form.

9. The circuit board of claim 8 , wherein the bending hole passes through the support substrate on the bending portion.

10. The circuit board of claim 8 , further comprising an insulating substrate formed on the support substrate, wherein the interconnection line is formed on one surface of the insulating substrate and the bending hole is formed in the support substrate on another surface of the insulating substrate.

11. The circuit board of claim 8 , wherein a cross section of the bending hole comprises at least two edges at a bottom.

12. The circuit board of claim 8 , wherein a cross section of the bending hole is formed in a curved line.

13. A lighting device, comprising:
the circuit board of claim 1 ; and
a light guide plate disposed to be spaced apart from the circuit board.

Assignees

• Lg Innotek Co Ltd

Inventors

• Park Hyun Gyu
• Kim Min Jae
• Na Se Woong
• Cho In Hee
• Choi Man Hue
• Hong Seung Kwon

Classifications

• F21V21/14 Primary

  Adjustable mountings · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K2201/0394

  Conductor crossing over a hole in the substrate or a gap between two separate substrate parts · CPC title

• H05K2201/09063

  Holes or slots in insulating substrate not used for electrical connections · CPC title

• G02F1/133615

  Edge-illuminating devices, i.e. illuminating from the side · CPC title