Hot-melt adhesive resin film and production method thereof
US-11904577-B2 · Feb 20, 2024 · US
1-butene α-olefin copolymer composition
US9505958B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9505958-B2 |
| Application number | US-201314426951-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 13, 2013 |
| Priority date | Sep 14, 2012 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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- Title
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- Abstract
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- Assignees and inventors
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Abstract
Official abstract text for this publication.
An object of the invention is to provide compositions which have low-temperature heat sealing properties, are free from stickiness, may achieve a heat seal strength controlled within a certain definite range when heat sealing takes place at low temperatures, have small changes in heat seal strength with time, and are such that in the packaging applications, the strength required to open the packages may be easily controlled within a certain definite range, and high-performance packages may be designed. The invention resides in a 1-butene.α-olefin copolymer composition including 99 to 1 parts by mass of at least one olefin polymer (X) selected from propylene polymers (X-1) and ethylene polymers (X-2), and 1 to 99 parts by mass of a 1-butene.α-olefin copolymer (Y) containing 0.1 to 30 mol % of one or more α-olefins selected from α-olefins and having a molecular weight distribution (Mw/Mn) of 1.0 to 3.5 [wherein the total of (X) and (Y) in the composition is 100 parts by mass].
First claim
Opening claim text (preview).
The invention claimed is: 1. A 1-butene.α-olefin copolymer composition comprising: 99 to 1 parts by mass of at least one olefin polymer (X) selected from propylene polymers (X-1) containing 50 mol % or more of propylene and ethylene polymers (X-2) containing 50 mol % or more of ethylene; and 1 to 99 parts by mass of a 1-butene.α-olefin copolymer (Y) containing 99.9 to 70 mol % of 1-butene and 0.1 to 30 mol % of one or more α-olefins selected from ethylene, propylene and C5 to C1…
Assignees
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Classifications
- C08L23/20Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- C08L23/0815Primary
Chemistry & Metallurgy · mapped topic
- C08F210/08Primary
Chemistry & Metallurgy · mapped topic
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- What does patent US9505958B2 cover?
- An object of the invention is to provide compositions which have low-temperature heat sealing properties, are free from stickiness, may achieve a heat seal strength controlled within a certain definite range when heat sealing takes place at low temperatures, have small changes in heat seal strength with time, and are such that in the packaging applications, the strength required to open the pac…
- Who is the assignee on this patent?
- Mitsui Chemicals Inc
- What technology area does this patent fall under?
- Primary CPC classification C08L23/20. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).