Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-9505953-B2
Application number	US-201514660244-A
Country	US
Kind code	B2
Filing date	Mar 17, 2015
Priority date	Sep 28, 2012
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

The invention is directed to a temporary adhesive containing (A) a polymer compound having a radical polymerizable group in its side chain, (B) a radical polymerizable monomer, and (C) a heat radical polymerization initiator, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

First claim

The invention claimed is:

1. A production method of semiconductor device having a member processed comprising:
adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from a temporary adhesive containing (A) a polymer compound having a radical polymerizable group in a side chain of the polymer compound, (B) a radical polymerizable monomer, and (C) a heat radical polymerization initiator;
conducting a mechanical or chemical processing…

Assignees

• Fujifilm Corp

Inventors

• Iwai Yu
• Fujimaki Kazuhiro
• Koyama Ichiro

Classifications

• H10P72/7422

  Electricity · mapped topic

• H10P72/7416

  Electricity · mapped topic

• H10P72/7412

  Electricity · mapped topic

• H10P72/744

  Electricity · mapped topic

• H10P95/08

  Electricity · mapped topic