Methods for chemical mechanical polishing and forming interconnect structure
US-2024290629-A1 · Aug 29, 2024 · US
Polishing composition and method for producing substrate
US9505950B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9505950-B2 |
| Application number | US-201314423945-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 12, 2013 |
| Priority date | Aug 31, 2012 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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Abstract
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A polishing composition includes a water-soluble polymer having a weight average molecular weight of 1000000 or less and a molecular weight distribution represented by weight average molecular weight (Mw)/number average molecular weight (Mn) that is less than 5.0. The polishing composition is mainly used in an application for polishing a substrate, preferably in an application for performing final polishing on a substrate.
First claim
Opening claim text (preview).
The invention claimed is: 1. A polishing composition comprising at least one water-soluble polymer selected from the group consisting of a cellulose derivative, a starch derivative, polyvinyl alcohol, a partially saponified vinyl acetate-based polymer, a block copolymer of polyoxyethylene and polyoxypropylene, and a nitrogen-containing polymer having a nitrogen atom in a main chain or in a side chain functional group, wherein: the cellulose derivative has a weight average molecula…
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Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- C09G1/02Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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- What does patent US9505950B2 cover?
- A polishing composition includes a water-soluble polymer having a weight average molecular weight of 1000000 or less and a molecular weight distribution represented by weight average molecular weight (Mw)/number average molecular weight (Mn) that is less than 5.0. The polishing composition is mainly used in an application for polishing a substrate, preferably in an application for performing fi…
- Who is the assignee on this patent?
- Fujimi Inc
- What technology area does this patent fall under?
- Primary CPC classification C09G1/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).