Polyamide molding materials with improved thermal aging and hydrolysis stability

Patent metadata

Field	Value
Publication number	US-9505912-B2
Application number	US-37745007-A
Country	US
Kind code	B2
Filing date	Aug 7, 2007
Priority date	Aug 23, 2006
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

Thermoplastic molding compositions, comprising:
(A) from 20 to 85% by weight of at least one polyamide whose number of amino end groups is ≧50 mmol/kg, (B) from 14.9 to 60% by weight of glass fibers. (C) from 0.01 to 2% by weight of at least one heat stabilizer, (D) from 0 to 1.5% by weight of at least one mold-release agent, and (E) from 0 to 30% by weight of other additives,

where the total of the percentages by weight of (A)-(E) is 100.

First claim

The invention claimed is:

1. A thermoplastic molding composition consisting of
(A) from 40 to 75% by weight of at least one linear, aliphatic polyamide wherein the number of primary amino end groups in the polyamide A) is ≧50 mmol/kg,
(B) from 14.9 to 60% by weight of glass fibers,
C) from 0.01 to 2% by weight of at least one heat stabilizer which has been selected from the group consisting of compounds of mono- and divalent copper, stabilizers based on secondary aromatic amines, stabilizers based on sterically hindered phenols, and mixtures of these,
(D) from 0 to 1.5% by weight of at least one mold-release agent, and
(E) from 0 to 30% by weight of other additives, and
at least one copper compound is added and the total amount of copper is from 0.01 to 0.2 percent by weight in respect to components (A)-(E) and
where the total of the percentages by weight of (A)-(E) is 100 based on the thermoplastic molding composition.

2. The molding composition according to claim 1 , wherein the number of primary amino end groups in the polyamide A) is >60 mmol/kg.

3. The molding composition according to claim 1 , wherein the molar proportion of chains regulated by a diamine is ≧30 mol % in the polyamide A).

4. The molding composition according to claim 1 , wherein the viscosity number of the polyamide A) is from 100 to 250 ml/g.

5. The molding composition according to claim 1 , wherein the diameter of the glass fibers is from 5 to 15 μm.

6. The molding composition according to claim 1 , wherein the polyamide A) has been selected from the group consisting of polyhexamethyleneadipamide (nylon-6,6), a mixture of polyamides with nylon-6,6 content of at least 80% by weight or a copolyamide having at least 80% by weight of units derivable from adipic acid and from hexamethylenediamine, polycaprolactam (nylon-6), and mixtures of these.

7. A molding obtained from the thermoplastic molding compositions according to claim 1 .

8. The molding composition according to claim 4 , wherein the molar proportion of chains regulated by a diamine is ≧30 mol % in the polyamide A).

9. The molding composition according to claim 2 , wherein the molar proportion of chains regulated by a diamine is ≧30 mol % in the polyamide A).

10. The molding composition according to claim 3 , wherein the viscosity number of the polyamide A) is from 100 to 250 ml/g.

11. The molding composition according to claim 2 , wherein the viscosity number of the polyamide A) is from 100 to 250 ml/g.

12. The molding composition according to claim 6 , wherein the viscosity number of the polyamide A) is from 100 to 250 ml/g.

13. The molding composition according to claim 6 , wherein the diameter of the glass fibers is from 5 to 15 μm.

14. The molding composition according to claim 2 , wherein the diameter of the glass fibers is from 5 to 15 μm.

15. The molding composition according to claim 3 , wherein the diameter of the glass fibers is from 5 to 15 μm.

16. The molding composition according to claim 4 , wherein the diameter of the glass fibers is from 5 to 15 μm.

17. The molding composition according to claim 1 , wherein the heat stabilizer C) is mono- or divalent copper that is used in combination with metal halides.

18. A thermoplastic molding composition consisting of
(A) from 40 to 75% by weight of at least one linear, aliphatic polyamide wherein the number of primary amino end groups in the polyamide A) is ≧50 mmol/kg,
(B) from 14.9 to 60% by weight of glass fibers,
(C) from 0.01 to 2% by weight of at least one heat stabilizer which has been selected from the group consisting of compounds of mono- and divalent copper, stabilizers based on secondary aromatic amines, stabilizers based on sterically hindered phenols, and mixtures of these,
(D) from 0 to 1.5% by weight of at least one mold-release agent, and
(E) from 0 to 30% by weight of other additives selected from the group consisting of pigments, mineral fillers, impact modifier, flame retardant, nucleating agent, sodium hypophosphite, and mixtures thereof, and
at least one copper compound is added and the total amount of copper is from 0.01 to 0.2 percent by weight in respect to components (A)-(E) and
where the total of the percentages by weight of (A)-(E) is 100 based on the thermoplastic molding composition.

19. A thermoplastic molding composition comprising
(A) from 40 to 75% by weight of at least one linear, aliphatic polyamide wherein the number of primary amino end groups in the polyamide A) is ≧60 mmol/kg,
(B) from 14.9 to 60% by weight of glass fibers,
(C) from 0.01 to 2% by weight of at least one heat stabilizer which has been selected from the group consisting of compounds of mono- and divalent copper, stabilizers based on secondary aromatic amines, stabilizers based on sterically hindered phenols, and mixtures of these,
(D) from 0 to 1.5% by weight of at least one mold-release agent, and
(E) from 0 to 30% by weight of other additives, and
at least one copper compound is added and the total amount of copper is from 0.01 to 0.2 percent by weight in respect to components (A)-(E) and

where the total of the percentages by weight of (A)-(E) is 100 based on the thermoplastic molding composition.

20. The molding composition according to claim 1 , wherein component (E) the other additive is selected from the group consisting of pigments, mineral fillers, impact modifier, flame retardant, nucleating agent, sodium hypophosphite, and mixtures thereof.

Assignees

• Eibeck Peter
• Engelmann Jochen
• Neuhaus Ralf
• Bernnat Anka
• Basf Se

Inventors

• Eibeck Peter
• Engelmann Jochen
• Neuhaus Ralf
• Bernnat Anka

Classifications

• C08L77/06

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• C08K13/04

  Ingredients characterised by their shape and organic or inorganic ingredients · CPC title

• C08K7/14 Primary

  Glass · CPC title

• C08L2201/08

  Stabilised against heat, light or radiation or oxydation · CPC title

• C08L2203/12

  used for fibers · CPC title