Resin composition for EMI shielding, comprising carbon hydride composite

Patent metadata

Field	Value
Publication number	US-9505903-B2
Application number	US-201314371807-A
Country	US
Kind code	B2
Filing date	Jan 4, 2013
Priority date	Jan 12, 2012
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

Provided is a resin composition for electromagnetic interference shielding. More particularly, provided is a resin composition having superior dispersibility and impact relaxation and high conductivity, the resin comprising: (a) 100 parts by weight of a resin; based on 100 parts by weight of the resin, (b) 0.1 to 15 parts by weight of a carbon nanotube surface-modified in a condition of the absence of oxidant; and (c) 1 to 40 parts by weight of a carbon compound, a metal, a metal compound, or a mixture thereof. The resin composition for electromagnetic interference shielding, comprising a carbon hydride composite, is specifically useful in an electronic control unit material for weight reduction of car, and thus can be replaced with a high-priced heavy metal material.

First claim

The invention claimed is:

1. A resin composition for electromagnetic interference (EMI) shielding, the resin composition comprising:
(a) 100 parts by weight of a resin;
based on 100 parts by weight of the resin,
(b) 0.1 to 15 parts by weight of a carbon nanotube surface-modified in a condition of the absence of oxidant; and
(c) 1 to 40 parts by weight of a carbon compound, metal, metal compound, or mixture thereof,
wherein
the carbon nanotube surface-modified in a condition of the absence of oxidant is obtained by surface-treating a conductive additive consisting of a carbon nanotube in a subcritical water or a supercritical water condition of a pressure of 50 to 400 atm and a temperature of 100 to 600° C., and
at least the carbon compound is not surface-modified in a condition in the absence of oxidant.

2. The resin composition of claim 1 , wherein the resin is one resin, a copolymer resin of two or more, or a mixture of two or more, selected from the group consisting of a polyacetal resin, an acryl based resin, a polycarbonate resin, a styrene based resin, a polyester resin, a vinyl based resin, a polyphenylene ether resin, a polyolefin resin, an acrylonitrile-butadiene-styrene copolymer resin, a polyarylate resin, a polyamide resin, a polyamideimide resin, a polyarylsulfone resin, a polyetherimide resin, a polyethersulfone resin, a polyphenylene sulfide resin, a fluorine based resin, a polyimide resin, a polyether ketone resin, a polybenzoxazole resin, a polyoxadiazol resin, a polybenzothiazole resin, a polybenzimidazole resin, a polypyridine resin, a polytriazole resin, a polypyrrolidone resin, a polydibenzofuran resin, a polysulfone resin, a polyurea resin, a polyphosphazene resin, a liquid crystal polymer resin, a silicon based resin, an epoxy resin, a phenol based resin, and a polyurethane resin.

3. The resin composition of claim 1 , wherein the carbon nanotube is selected from the group consisting of a single-walled carbon nanotube, a double-walled carbon nanotube, a thin multi-walled carbon nanotube, a multi-walled carbon nanotube, a roped carbon nanotube, and a combination thereof.

4. The resin composition of claim 1 , wherein the carbon compound is selected from the group consisting of carbon black, graphene, fullerene, graphite, graphite oxide, carbon fiber, and a mixture thereof.

5. The resin composition of claim 1 , wherein the metal or metal compound is selected from the group consisting of copper, iron, nickel, aluminum, tin, zinc, silver, gold, nickel-copper alloy, alumina (Al 2 O 3 ), alumina nitride (AlN), and oxides thereof.

6. The resin composition of claim 1 , wherein the carbon compound, metal, or metal compound has an average particle size of 0.001˜300 μm.

7. The resin composition of claim 1 , wherein a weight ratio of the (b) carbon nanotube surface-modified in a condition of the absence of oxidant to the (c) carbon compound, metal, metal compound, or mixture thereof is 1:0.01 to 1:100.

8. A molded article manufactured by extruding, ejecting, or heat-molding the resin composition for EMI shielding of claim 1 .

9. The molded article of claim 8 , wherein the molded article is a plastic molded article capable of allowing thermal conductivity, electrostatic dispersion, or prevention of static electricity, by controlling an EMI shielding effect.

Assignees

• Hanwha Chemical Corp

Inventors

• Lee Jin Seo
• Jung Man Woo
• Do Seung Hoe
• Jeon Seong Yun
• Lim Jae Yun

Classifications

• C08K9/00

  Use of pretreated ingredients · CPC title

• C08K3/04 Primary

  Carbon · CPC title

• C08K3/08

  Metals · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• C08J2323/12

  Polypropene · CPC title