Mold assemblies for forming shaped glass articles

US9505648B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9505648-B2
Application numberUS-201514713171-A
CountryUS
Kind codeB2
Filing dateMay 15, 2015
Priority dateMay 19, 2014
Publication dateNov 29, 2016
Grant dateNov 29, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Mold assemblies for forming shaped glass articles are disclosed herein. According to one embodiment, a mold assembly may include a mold body including a mold cavity, a support base, and a plenum body extending between the mold body and the support base. When the mold assembly is heated to an average temperature of greater than or equal to about 650° C. by an overhead heating source, the temperature at the center of the mold cavity may be less than at the perimeter of the mold cavity. The difference between the temperature at the center of the mold cavity and the temperature at the perimeter of the mold cavity may be at least about 12° C.

First claim

Opening claim text (preview).

What is claimed is: 1. A mold assembly for forming a shaped glass article, the mold assembly comprising: a mold body comprising a base portion defining an underside of the mold body and a forming portion protruding from a top of the base portion, wherein the forming portion comprises a mold cavity having a three-dimensional profile corresponding to a shape of the shaped glass article; a support base positioned below the mold body; a plenum body extending between the mold body and the support base, the plenum body comprising a plenum wall encircling a plenum space bounded by the plenum body, the mold body, and the support base, wherein: the underside of the mold body comprises an annular channel adjacent to a projected perimeter of the mold cavity, the annular channel restricting thermal conduction from the mold body adjacent to an edge of the mold cavity to a central region of the mold cavity; and when the mold assembly is heated to an average temperature of greater than or equal to about 650° C., a temperature at a center of the mold cavity is less than at a perimeter of the mold cavity, and a difference between the temperature at the center of the mold cavity and the temperature at the perimeter of the mold cavity is at least about 12° C. 2. The mold assembly of claim 1 , wherein an outer perimeter of the plenum wall comprises a channel wherein a thickness of the plenum wall in the channel is less than a thickness of the plenum wall outside the channel such that the channel restricts thermal conduction from the edge of the mold cavity, through the plenum body, to the support base. 3. The mold assembly of claim 1 , wherein a depth of the annular channel is greater near a projected center of the mold cavity than near sides of the forming portion of the mold body. 4. The mold assembly of claim 1 , wherein at least a portion of the mold body comprises a thermal coating having an emissivity of at least about 0.9 at about 700° C. 5. The mold assembly of claim 4 , wherein at least a portion of the mold body adjacent to the perimeter of the mold cavity comprises the thermal coating having an emissivity of at least about 0.9 at about 700° C. 6. The mold assembly of claim 4 , wherein at least a portion of the underside of the mold body beneath the mold cavity comprises the thermal coating having an emissivity of at least about 0.9 at about 700° C. 7. The mold assembly of claim 1 , wherein the mold assembly further comprises a cooling apparatus positioned in the plenum space adjacent to the underside of the mold body proximate a central portion of the mold cavity. 8. The mold assembly of claim 7 , wherein the cooling apparatus is a heat exchanger. 9. The mold assembly of claim 1 , wherein the plenum body is in direct contact with the base portion of the mold body at the perimeter of the base portion of the mold body and the plenum space is below the mold cavity. 10. A mold assembly for forming a shaped glass article, the mold assembly comprising: a mold body comprising a base portion defining an underside of the mold body and a forming portion protruding from a top of the base portion, wherein the forming portion comprises a mold cavity having a three-dimensional profile corresponding to a shape of the shaped glass article; a support base positioned below the mold body; a plenum body extending between the mold body and the support base, the plenum body comprising a plenum wall encircling a plenum space bounded by the plenum body, the mold body, and the support base, wherein: the forming portion of the mold body comprises notches or diagonal facets adjacent to corners of the mold cavity, wherein the notches or diagonal facets promote increased temperature in the corners of the mold cavity; and when the mold assembly is heated to an average temperature of greater than or equal to about 650° C., a temperature at a center of the mold cavity is less than at a perimeter of the mold cavity, and a difference between the temperature at the center of the mold cavity and the temperature at the perimeter of the mold cavity is at least about 12° C. 11. The mold assembly of claim 10 , wherein an outer perimeter of the plenum wall comprises a channel wherein a thickness of the plenum wall in the channel is less than a thickness of the plenum wall outside the channel such that the channel restricts thermal conduction from an edge of the mold cavity, through the plenum body, to the support base. 12. The mold assembly of claim 10 , wherein at least a portion of the mold body comprises a thermal coating having an emissivity of at least about 0.9 at about 700° C. 13. The mold assembly of claim 12 , wherein at least a portion of the mold body adjacent to the perimeter of the mold cavity comprises the thermal coating having an emissivity of at least about 0.9 at about 700° C. 14. The mold assembly of claim 12 , wherein at least a portion of the underside of the mold body beneath the mold cavity comprises the thermal coating having an emissivity of at least about 0.9 at about 700° C. 15. The mold assembly of claim 10 , wherein the mold assembly further comprises a cooling apparatus positioned in the plenum space adjacent to the underside of the mold body proximate a central portion of the mold cavity. 16. The mold assembly of claim 15 , wherein the cooling apparatus is a heat exchanger. 17. The mold assembly of claim 10 , wherein the plenum body is in direct contact with the base portion of the mold body at the perimeter of the base portion of the mold body and the plenum space is below the mold cavity. 18. A mold assembly for forming a shaped glass article, the mold assembly comprising: a mold body comprising a base portion defining an underside of the mold body and a forming portion protruding from a top of the base portion, wherein the forming portion comprises a mold cavity having a three-dimensional profile corresponding to a shape of the shaped glass article; a support base positioned below the mold body; a plenum body extending between the mold body and the support base, the plenum body comprising a plenum wall encircling a plenum space bounded by the plenum body, the mold body, and the support base, wherein: an outer perimeter of the plenum wall comprises a channel wherein a thickness of the plenum wall in the channel is less than a thickness of the plenum wall outside the channel such that the channel restricts thermal conduction from the edge of the mold cavity, through the plenum body, to the support base; the underside of the mold body comprises an annular channel adjacent to a projected perimeter of the mold cavity, the annular channel restricting thermal conduction from the mold body adjacent to an edge of the mold cavity to a central region of the mold cavity; the forming portion of the mold body comprises notches adjacent to corners of the mold cavity, the notches promoting increased temperature in the corners of the mold cavity; and the forming portion of the mold body comprises diagonal facets adjacent to the corners of the mold cavity, the diagonal facets promoting increased temperature in the corners of the mold cavity.

Assignees

Inventors

Classifications

  • Improving the yield, e-g- reduction of reject rates · CPC title

  • involving applying local or additional heating, cooling or insulating means · CPC title

  • Press-bending involving applying local or additional heating, cooling or insulating means · CPC title

  • Heating · CPC title

  • Cooling · CPC title

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What does patent US9505648B2 cover?
Mold assemblies for forming shaped glass articles are disclosed herein. According to one embodiment, a mold assembly may include a mold body including a mold cavity, a support base, and a plenum body extending between the mold body and the support base. When the mold assembly is heated to an average temperature of greater than or equal to about 650° C. by an overhead heating source, the tempera…
Who is the assignee on this patent?
Corning Inc
What technology area does this patent fall under?
Primary CPC classification C03B23/0235. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).