Mold set

US9505149B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9505149-B2
Application numberUS-201414283958-A
CountryUS
Kind codeB2
Filing dateMay 21, 2014
Priority dateMay 22, 2013
Publication dateNov 29, 2016
Grant dateNov 29, 2016

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A mold set according to embodiment comprising: a die including a plurality of parts and holding a molded material; and a back plate laid below the die.

First claim

Opening claim text (preview).

What is claimed is: 1. A mold set comprising: a die including a plurality of parts and a protruding portion protruding to an outer side, the die holding a molded material; a back plate laid below the die, the back plate comprising an undersurface and a venting groove along a traveling direction formed on the undersurface; and a sleeve surrounding an outer circumference of the die, wherein the sleeve and the back plate are integrated with each other by sandwiching the protrudin…

Assignees

Inventors

Classifications

  • Operations & Transport · mapped topic

  • B29C33/34Primary

    Operations & Transport · mapped topic

  • Operations & Transport · mapped topic

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Frequently asked questions

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What does patent US9505149B2 cover?
A mold set according to embodiment comprising: a die including a plurality of parts and holding a molded material; and a back plate laid below the die.
Who is the assignee on this patent?
Toshiba Machine Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C33/34. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).