Automated sanding system and method

US9505101B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9505101-B1
Application numberUS-201514748356-A
CountryUS
Kind codeB1
Filing dateJun 24, 2015
Priority dateJun 24, 2015
Publication dateNov 29, 2016
Grant dateNov 29, 2016

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sanding system may include a leading roller assembly having a first measuring device that is configured to measure a first thickness of a component at a location proximate the leading roller assembly. A trailing roller assembly may include a second measuring device that is configured to measure a second thickness of the component at a location proximate the trailing roller assembly. A sander disposed between the leading and trailing roller assemblies is configured to sand a portion of the component. A control unit is coupled to the leading roller assembly, the trailing roller assembly, and the sander. The control unit may be configured to drive the sanding system in relation to the component and operate the sander based on analysis of the first thickness measured by the first measuring device and the second thickness measured by the second measuring device.

First claim

Opening claim text (preview).

What is claimed is: 1. A sanding system configured to sand a portion of a component, the sanding system comprising: a leading roller assembly including a first measuring device, wherein the first measuring device is configured to measure a first thickness of the component at a location proximate the leading roller assembly; a trailing roller assembly including a second measuring device, wherein the second measuring device is configured to measure a second thickness of the component at a location proximate the trailing roller assembly; a sander disposed between the leading roller assembly and the trailing roller assembly configured to sand the portion of the component; and a control unit coupled to the leading roller assembly, the trailing roller assembly, and the sander, wherein the control unit comprises at least one processor, and a memory coupled to the at least one processor, wherein the memory stores program instructions, wherein the program instructions are executable by the at least one processor to drive the sanding system in relation to the component and operate the sander based on analysis of the first thickness measured by the first measuring device and the second thickness measured by the second measuring device. 2. The sanding system of claim 1 , further comprising at least one motor operatively coupled to the control unit and one or both of the leading roller assembly and the trailing roller assembly, wherein the at least one motor is configured to drive the sanding system over the portion of the component. 3. The sanding system of claim 1 , further comprising a tension roller assembly having at least one roller that is configured to engage a surface of the component, wherein the tension roller assembly is configured to bias the sander into the component. 4. The sanding system of claim 1 , further comprising an actuator operatively connected to the sander, wherein the control unit is coupled to the sander through the actuator. 5. The sanding system of claim 1 , wherein the leading roller assembly comprises a first roller and a second roller, wherein the location of the component proximate the leading roller assembly is the portion of the component positioned between the first and second rollers, wherein the trailing roller assembly comprises a third roller and a fourth roller, and wherein the location of the component proximate the trailing roller assembly is the portion of the component positioned between the third and fourth rollers. 6. The sanding system of claim 5 , wherein the first roller connects to the second roller through a first connecting shaft, and wherein the third roller connects to the fourth roller through a second connecting shaft. 7. The sanding system of claim 6 , wherein the first measuring device is secured to one or more of the first roller, the second roller, or the first connecting shaft, and wherein the second measuring device is secured to one or more of the third roller, the fourth roller, or the second connecting shaft. 8. The sanding system of claim 6 , wherein the first connecting shaft comprises a first biasing spring that biases the first and second rollers toward one another, and wherein the second connecting shaft comprises a second biasing spring that biases the third and fourth rollers toward one another. 9. The sanding system of claim 1 , further comprising: a mounting cover that surrounds a perimeter of the sander; and a housing mounted on the mounting cover, wherein the housing contains the control unit. 10. The sanding system of claim 9 , wherein the mounting cover comprises a vacuum port that is configured to connect to a vacuum that is configured to remove debris generated by operation of the sander through the vacuum port. 11. The sanding system of claim 1 , wherein the control unit is remotely located from and in communication with leading roller assembly, the trailing roller assembly, the motor, and the sander. 12. The sanding system of claim 1 , wherein the program instructions are executable by the at least one processor to: monitor the first thickness to determine an amount of material to be sanded from the component, and monitor the second thickness to determine if a sanded portion of the component is at or within a specified thickness. 13. The sanding system of claim 1 , wherein at least one of the first and second measuring devices comprises a rotational position sensor comprising at least one wheel, wherein the program instructions are executable by the at least one processor to monitor rotational positions of the at least one wheel. 14. The sanding system of claim 1 , further comprising a support base connected to the sander, wherein a height of the support base in relation to the component is adjustable. 15. A method of sanding a portion of a component, the method comprising: driving a sanding system over the portion of the component; using a first measuring device of a leading roller assembly of the sanding system to measure a first thickness of the component at a location proximate the leading roller assembly; using a second measuring device of a trailing roller assembly of the sanding system to measure a second thickness of the component at a location proximate the trailing roller assembly; analyzing the first thickness measured by the first measuring device and the second thickness measured by the second measuring device; and operating a sander based the analyzing. 16. The method of claim 15 , further comprising removing debris caused by the operating through a vacuum port. 17. The method of claim 15 , wherein analyzing comprises: monitoring the first thickness to determine an amount of material to be sanded from the component, and monitoring the second thickness to determine if a sanded portion of the component is at or within a specified thickness. 18. The method of claim 17 , further comprising adjusting a position of the sander in relation to the component based on the analyzing. 19. A sanding system configured to sand a portion of a component, the sanding system comprising: a leading roller assembly including a first measuring device, wherein the first measuring device is configured to measure a first thickness of the component at a location proximate the leading roller assembly; a trailing roller assembly including a second measuring device, wherein the second measuring device is configured to measure a second thickness of the component at a location proximate the trailing roller assembly; at least one motor coupled to one or both of the leading roller assembly and the trailing roller assembly, wherein the at least one motor is configured to drive the sanding system over the portion of the component; a sander disposed between the leading roller assembly and the trailing roller assembly configured to sand the portion of the component; a mounting cover that surrounds a perimeter of the sander, wherein the mounting cover includes a vacuum port that is configured to connect to a vacuum that is configured to remove debris generated by operation of the sander through the vacuum port; an adjustable support base connected to the mounting cover, wherein a height of the actuator in relation to the component is adjustable; a tension roller assembly that is configured to bias the sander into the component; and a control unit coupled to the leading roller assembly, the trailing roller assembly, the at least one motor, and the sander, wherein the control unit comprises at least one processor, and a memory coupled to the at least one processor, wherein the me

Assignees

Inventors

Classifications

  • B24B49/04Primary

    involving measurement of the workpiece at the place of grinding during grinding operation · CPC title

  • Specially adapted gauging instruments · CPC title

  • specially designed for portable grinding machines, e.g. hand-guided · CPC title

  • Portable grinding machines designed for fastening on workpieces or other parts of particular section, e.g. for grinding commutators · CPC title

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Frequently asked questions

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What does patent US9505101B1 cover?
A sanding system may include a leading roller assembly having a first measuring device that is configured to measure a first thickness of a component at a location proximate the leading roller assembly. A trailing roller assembly may include a second measuring device that is configured to measure a second thickness of the component at a location proximate the trailing roller assembly. A sander …
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B24B49/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).