Compound, composition comprising the compound and cured product

US9504632B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9504632-B2
Application numberUS-201213471765-A
CountryUS
Kind codeB2
Filing dateMay 15, 2012
Priority dateMay 16, 2011
Publication dateNov 29, 2016
Grant dateNov 29, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1):

First claim

Opening claim text (preview).

What is claimed is: 1. A compound having the structure of Formula (1): wherein in Formula (1), R 1 and R 2 both indicate hydrogen atoms, A is a divalent organic group selected from the group consisting of structures (a) to (h) described below, X 1 and X 2 each indicate a divalent organic group, at least one of X 1 and X 2 is a divalent organic group selected from the group consisting of structures (i) to (m) described below, and the groups A, X 1 and X 2 have three or more ring structures in total (with the proviso that the compound is not a compound in which A is the structure (c) or (d) and X 1 and X 2 are both the structures (i) in which R 3 is a phenyl group, a compound in which A is the structure (a), R 1 and R 2 are both methyl groups and X 1 and X 2 are both the structures (i) in which R 3 is a phenyl group, a compound having the structure of Formula (2-7) or a compound having the structure of Formula (4)): wherein with respect to the organic groups (a) to (m), R 3 is an aryl group or a cycloalkyl group which may have a substituent, R 4 , R 5 , R 6 and R 7 each independently indicate a hydrogen atom or a methyl group, and R 8 is an alkyl group having 4 to 20 carbon atoms, 2. The compound according to claim 1 , which has the structure of Formula (1) in which the group A is a divalent organic group selected from the group consisting of the structures (a), (b), (c), (d), (e) and (h). 3. The compound according to claim 1 , which has the structure of Formula (1) in which the group A is a divalent organic group selected from the group consisting of the structures (a), (c), (e) and (h). 4. The compound according to claim 1 , which has the structure of Formula (1) in which the group A is a divalent organic group selected from the group consisting of the structures (a), (e) and (h). 5. The compound according to claim 1 , which has the structure of Formula (1) in which the divalent organic group A is the structure (a). 6. The compound according to claim 1 , which has the structure of Formula (1) in which at least one of X 1 and X 2 is a divalent organic group selected from the group consisting of the structures (i), (j), (l) and (m). 7. The compound according to claim 1 , which has the structure of Formula (1) in which one of X 1 and X 2 is a divalent organic group selected from the group consisting of the structures (i), (j) and (m). 8. The compound according to claim 1 , which has the structure of Formula (1) in which the group A is any of the structures (a), (b), (c) and (e) and X 1 and X 2 are both the structures (i). 9. The compound according to claim 1 , which has the structure of Formula (1) with the proviso that the compound is not: a compound in which A is the structure (a), (b), (c) or (d) and X 1 and X 2 are both the structures (i) in which R 3 is a phenyl group, a compound in which A is the structure (a), (b), (c) or (d) and X 1 and X 2 are both the structures (1) in which R 3 is an alkyl group having 4 to 20 carbon atoms, a compound in which A is the structure (a), R 1 and R 2 are both methyl groups and X 1 and X 2 are both the structures (i) in which R 3 is a phenyl group, a compound having the structure of Formula (2-7) or a compound having the structure of Formula (4). 10. The compound according to claim 1 , which is a compound selected from compounds having the structures of Formulas (2), (3) and (5) below: 11. A composition which comprises the compound according to claim 1 . 12. The composition according to claim 11 , further comprising a polymerization initiator (B) and a filler (C). 13. The composition according to claim 11 , further comprising a polymerizable monomer (D). 14. The composition according to claim 13 , wherein the polymerizable monomer (D) has the structure of Formula 6: wherein in Formula (6), R each independently indicate a hydrogen atom or a methyl group, m and n each indicate an integer of 0 to 10, and m+n=0 to 10. 15. The composition according to claim 14 , wherein in Formula (6), R each indicate a hydrogen atom, m and n each indicate an integer of 0 to 6, and m+n=2 to 6. 16. A cured product obtained by curing the compound according to claim 1 . 17. A cured product obtained by curing the composition according claim 11 . 18. The compound according to claim 1 , wherein R 3 in structure (i) is a phenyl group or a nonyl phenyl group.

Assignees

Inventors

Classifications

  • and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate · CPC title

  • with epoxy compounds having no active hydrogen (with epoxy resins containing active hydrogen C08G18/58) · CPC title

  • with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms · CPC title

  • with the nitrogen atom of at least one of the carbamate groups bound to a carbon atom of a six-membered aromatic ring · CPC title

  • with the nitrogen atom of at least one of the carbamate groups bound to a carbon atom of a ring other than a six-membered aromatic ring · CPC title

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What does patent US9504632B2 cover?
The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1):
Who is the assignee on this patent?
Naruse Hiroshi, Tanabe Yoshimitsu, Kohgo Osamu, and 7 more
What technology area does this patent fall under?
Primary CPC classification C07C271/10. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).