Cover assemblies, kits and methods for covering electrical cables and connections

Patent metadata

Field	Value
Publication number	US-9504195-B2
Application number	US-201514707110-A
Country	US
Kind code	B2
Filing date	May 8, 2015
Priority date	May 16, 2014
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A cover assembly for covering and electrically insulating an electrical connection includes a joint body including a tubular inner sleeve and an integral semiconductor layer. The inner sleeve is formed of an elastically expandable, electrically insulating material and having an outer surface and opposed first and second terminal ends. The inner sleeve defines a through passage extending axially from a first end opening at the first terminal end of the inner sleeve to a second terminal end opening at the second end of the inner sleeve. The semiconductor layer is disposed on the outer surface of the inner sleeve and is formed of an electrically semiconductive material. The semiconductor layer extends axially from a first terminal end of the semiconductor layer to an opposing second terminal end of the semiconductor layer. The first terminal end of the semiconductor layer is spaced apart from the first terminal end of the inner sleeve a prescribed semiconductor truncation distance to define a tubular band of the outer surface that is not covered by the semiconductor layer.

First claim

That which is claimed is:

1. A cover assembly for covering and electrically insulating an electrical connection, the cover assembly comprising:
a joint body including:
a tubular inner sleeve formed of an elastically expandable, electrically insulating material and having an outer surface and opposed first and second terminal ends, the inner sleeve defining a through passage extending axially from a first end opening at the first terminal end of the inner sleeve to a second terminal end opening at the second end of the inner sleeve;
an integral semiconductor layer on the outer surface of the inner sleeve and formed of an electrically semiconductive material, the semiconductor layer extending axially from a first terminal end of the semiconductor layer to an opposing second terminal end of the semiconductor layer; and
a tubular, metal shield layer surrounding the semiconductor layer;
wherein:
the first terminal end of the semiconductor layer is spaced apart from the first terminal end of the inner sleeve a prescribed semiconductor truncation distance to define a tubular band of the outer surface that is not covered by the semiconductor layer;
the metal shield layer extends axially from a first terminal end of the metal shield layer to an opposing second terminal end of the metal shield layer;
the first terminal end of the metal shield layer is spaced apart from the first terminal end of the inner sleeve a prescribed shield truncation distance to define a tubular band of the outer surface that is not covered by the metal shield layer; and
the joint body further includes a protective tape circumferentially surrounding the semiconductor layer radially between the semiconductor layer and the first terminal end of the metal shield layer.

2. The cover assembly of claim 1 wherein the second terminal end of the semiconductor layer extends to the second terminal end of the inner sleeve or is axially spaced therefrom a second semiconductor truncation distance that is less than the prescribed semiconductor truncation distance.

3. The cover assembly of claim 1 further including a removable holdout device mounted within the inner sleeve, wherein the holdout device is operative to temporarily maintain the inner sleeve in a radially expanded state.

4. The cover assembly of claim 1 further including:
a tubular outer sleeve surrounding the metal shield layer; and
a tubular separator layer interposed between the metal shield layer and the outer sleeve.

5. The cover assembly of claim 1 wherein the metal shield layer includes a shield extension section configured to be extended axially beyond the second terminal end of the inner sleeve.

6. The cover assembly of claim 1 further including a tubular outer sleeve surrounding the inner sleeve and the semiconductor layer, wherein the outer sleeve includes:
an intermediate section surrounding the inner sleeve; and
an outer section surrounding the intermediate section and joined thereto at an annular fold;
the annular fold being spaced apart from the first terminal end of the inner sleeve a prescribed fold truncation distance to define a tubular band of the outer surface that is not covered by the outer sleeve.

7. The cover assembly of claim 1 including:
a Faraday cage layer mounted within the inner sleeve and formed of an electrically conductive elastomer; and
a stress cone mounted in the inner sleeve proximate an end thereof and formed of an electrically conductive elastomer.

8. The cover assembly of claim 1 further including:
a removable holdout device mounted within the inner sleeve, wherein the holdout device is operative to temporarily maintain the inner sleeve in a radially expanded state;
a tubular outer sleeve surrounding the metal shield layer;
a Faraday cage layer mounted within the inner sleeve and formed of an electrically conductive elastomer; and
a stress cone mounted in the inner sleeve proximate an end thereof and formed of an electrically conductive elastomer;
wherein:
the second terminal end of the semiconductor layer extends to the second terminal end of the inner sleeve or is axially spaced therefrom a second semiconductor truncation distance that is less than the prescribed semiconductor truncation distance;
the metal shield layer includes a shield extension section configured to be extended axially beyond the second end of the inner sleeve; and
the outer sleeve includes:
an intermediate section surrounding the inner sleeve; and
an outer section surrounding the intermediate section and joined thereto at an annular fold;
the annular fold being spaced apart from the first terminal end of the inner sleeve a prescribed fold truncation distance to define a tubular band of the outer surface that is not covered by the outer sleeve.

9. A method for forming a protected connection assembly, the method comprising:
forming an electrical connection between first and second electrical cables;
providing a cover assembly including a joint body including:
a tubular inner sleeve formed of an elastically expandable, electrically insulating material and having an outer surface and opposed first and second terminal ends, the inner sleeve defining a through passage extending axially from a first end opening at the first terminal end of the inner sleeve to a second end opening at the second terminal end of the inner sleeve;
an integral semiconductor layer on the outer surface of the inner sleeve and formed of an electrically semiconductive material, the semiconductor layer extending axially from a first terminal end of the semiconductor layer to an opposing second terminal end of the semiconductor layer; and
a tubular, metal shield layer surrounding the semiconductor layer;
wherein the first terminal end of the semiconductor layer is spaced apart from the first terminal end of the inner sleeve a prescribed semiconductor truncation distance to define a tubular band of the outer surface that is not covered by the semiconductor layer; and

mounting the cover assembly on the first and second cables such that the first and second cables and the electrical connection extend through the inner sleeve, the first cable extends out of the inner sleeve through the first end opening, and the second cable extends out of the inner sleeve through the second end opening;
wherein:
the metal shield layer extends axially from a first terminal end of the metal shield layer to an opposing second terminal end of the metal shield layer;
the first terminal end of the metal shield layer is spaced apart from the first terminal end of the inner sleeve a prescribed shield truncation distance to define a tubular band of the outer surface that is not covered by the metal shield layer; and
when the protected connection assembly is formed, an annular gap is defined between the first terminal end of the inner sleeve and a first cable shield of the first cable to electrically isolate the metal shield layer from the first cable shield and thereby provide a shield break between the first cable shield and a second cable shield of the second cable.

10. The method of claim 9 wherein the second terminal end of the semiconductor layer extends to the second terminal end of the inner sleeve or is axially spaced therefrom a second semiconductor truncation distance that is less than the prescribed semiconductor truncation distance.

11. The method of claim 9 including:
providing a removable holdout device mounted within the inner sleeve, wherein the holdout device temporarily maintains the inner sleeve in a radially expanded state;
and thereafter removing the holdout from the inner sleeve to permit the inner sleeve to radially retract on to the first and seco

Assignees

• Tyco Electronics Corp
• Tyco Electronics Canada Ulc

Inventors

• Dinu Daniel
• Yaworski Harry
• Kennedy Sean
• Seraj Mahmoud

Classifications

• H02G15/184

  with devices for relieving electrical stress · CPC title

• Y10T29/49197

  including fluid evacuating or pressurizing · CPC title

• H05K9/0088 Primary

  comprising a plurality of shielding layers; combining different shielding material structure · CPC title

• H05K9/0007

  Casings (standardised racks H05K9/0062) · CPC title

• H02G15/1833 Primary

  formed of helically wound strip with adjacent windings, which are removable by applying a pulling force to a strip end · CPC title