Electronic assembly having a circuit board with a shock absorber device

Patent metadata

Field	Value
Publication number	US-9504172-B2
Application number	US-201414578646-A
Country	US
Kind code	B2
Filing date	Dec 22, 2014
Priority date	Dec 22, 2014
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

An electronic assembly including a printed circuit board (PCB), a housing, and a shock absorbing device that is intermediate the printed circuit board and the housing. The shock absorbing device is formed of an insulative and compliant material, such as a thermoplastic elastomer material. The side walls of the shock absorbing device defines a groove surrounds and at least partially encloses the edges of the printed circuit board. The shock absorbing device defines an aperture through which a fastener is configured to pass to secure the shock absorbing device to the housing and thus securing the printed circuit board within the housing. The shock absorbing device is intermediate the fastener and the printed circuit board so that there is no direct contact between the fastener and the printed circuit board which could transmit impact shock directly from the housing to the printed circuit board.

First claim

We claim:

1. An electronic assembly, comprising:
a housing defining a mounting boss;
a printed circuit board (PCB) having a first major surface, a second major surface opposite said first major surface, and a plurality of peripheral minor edges substantially perpendicular to the first and second major surfaces, wherein the PCB defines a central mounting hole in a central portion of the PCB, said PCB disposed within said housing;
a shock absorbing device formed of an insulative compliant material surrounding the plurality of peripheral minor edges of the PCB;
a bushing defining a first mounting hole therethrough and defining a shoulder, said bushing attached to the shock absorbing device by a webbing and integrally formed with the shock absorbing device of the insulative compliant material, wherein the bushing is disposed within the central mounting hole;
a perforated disk defining a second mounting hole therethrough, coaxial with the first mounting hole, integrally formed with the shock absorbing device of the insulative compliant material;
a fastener inserted through the first and second mounting hole and engaging the mounting boss such that the insulative compliant material of the shoulder is in contact with the first surface and intermediate the first surface and the mounting boss and such that the insulative compliant material of the perforated disk is in contact with the second surface and is intermediate the second surface and a head of the fastener, and
wherein the shock absorbing device further includes a flexible strand connecting the perforated disk to the shock absorbing device and integrally formed with the shock absorbing device of the insulative compliant material and wherein the flexible strand is folded to align the second mounting hole of the perforated disk with the first mounting hole of the bushing.

2. The electronic assembly according to claim 1 , wherein the shock absorbing device defines a groove configured to receive and enclose at least a portion of the plurality of peripheral minor edges of the PCB.

3. The electronic assembly according to claim 1 , wherein the PCB defines a generally rectangular shape and wherein the shock absorbing device defines a groove configured to receive and enclose at least a portion of the plurality of peripheral minor edges of the PCB.

4. The electronic assembly according to claim 1 , wherein the shock absorbing device defines a side wall configured to surround at least a portion of the plurality of peripheral minor edges of the PCB, a first lip substantially perpendicular to the side wall and configured to surround at least a portion of the first major surface, and a second lip substantially perpendicular to the side wall and configured to surround at least a portion of the second major surface.

5. The electronic assembly according to claim 4 , wherein the first lip and the second lip define a groove configured to receive and enclose at least the portion of the first major surface and the second major surface.

6. The electronic assembly according to claim 1 , wherein the shock absorbing device is formed of a thermoplastic elastomer material.

7. The electronic assembly according to claim 6 , wherein the shock absorbing device is formed of a thermoplastic vulcanizates material.

Assignees

• Delphi Tech Inc

Inventors

• Raschilla Anthony
• Marzo Steven William

Classifications

• G11B33/08

  Insulation or absorption of undesired vibrations or sounds · CPC title

• H04M1/185

  Improving the shock resistance of the housing, e.g. by increasing the rigidity · CPC title

• H05K5/0217 Primary

  Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03) · CPC title

• H05K5/0056 Primary

  characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors · CPC title

• H05K7/142

  Spacers not being card guides · CPC title