Circuit component bridge device

US9504159B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9504159-B2
Application numberUS-201414169423-A
CountryUS
Kind codeB2
Filing dateJan 31, 2014
Priority dateJan 31, 2014
Publication dateNov 22, 2016
Grant dateNov 22, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A bridge device is described herein. The bridge device may include a first via of a bridge device, the first via of the bridge device having a short via stub or no via stub, the first via of the bridge device to be communicatively coupled to a first via of a printed circuit board (PCB). The bridge device may include a second via of the bridge device, the second via of the bridge device having a short via stub or no via stub, the second via of the bridge device to be communicatively coupled to a second via of the PCB. A trace of the bridge device may communicatively couple the first via of the bridge device to the second via of the bridge device.

First claim

Opening claim text (preview).

What is claimed is: 1. A bridge device, comprising: a first via of a bridge device, the first via of the bridge device having a short via stub or no via stub, the first via of the bridge device to be communicatively coupled to a first via of a printed circuit board (PCB); a second via of the bridge device, the second via of the bridge device having a short via stub or no via stub, the second via of the bridge device to be communicatively coupled to a second via of the PCB; and…

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Frequently asked questions

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What does patent US9504159B2 cover?
A bridge device is described herein. The bridge device may include a first via of a bridge device, the first via of the bridge device having a short via stub or no via stub, the first via of the bridge device to be communicatively coupled to a first via of a printed circuit board (PCB). The bridge device may include a second via of the bridge device, the second via of the bridge device having a…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H05K1/18. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).