Piezoelectric device, piezoelectric actuator, piezoelectric sensor, hard disk drive, and inkjet printer apparatus
US-2015364670-A1 · Dec 17, 2015 · US
Piezoelectric component and method for producing a piezoelectric component
US9502634B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502634-B2 |
| Application number | US-201414151961-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 10, 2014 |
| Priority date | Jan 10, 2013 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
An electrically conductive contact layer ( 4 ) is provided with a joining material ( 9 ) during a method for producing a piezoelectric component ( 1 ), in particular a piezoelectric sensor ( 1 ). To this end, the electrically conductive contact layer ( 4 ) can be dipped into a paste that serves to form the joining material ( 9 ). The contact layer ( 4 ) provided with the joining material ( 9 ) is subsequently disposed between a first piezoceramic layer ( 2 ) and a second piezoceramic layer ( 3 ). The contact layer ( 4 ) is then inserted via the joining material ( 9 ) between the first piezoceramic layer ( 2 ) and the second piezoceramic layer ( 3 ), wherein a pressure is applied to the first piezocermaic layer ( 2 ) against the second piezoceramic layer ( 3 ).
First claim
Opening claim text (preview).
What is claimed is: 1. A method for producing a piezoelectric component ( 1 ), comprising providing an electrically conductive contact layer ( 4 ) at least partially with a joining material ( 9 ), disposing the contact layer ( 4 ) provided with the joining material ( 9 ) at least partially between a first piezoceramic layer and a second piezoceramic layer ( 3 ), and inserting the contact layer ( 4 ) via the joining material ( 9 ) between the first piezoceramic layer ( 2 ) and the second piezoceramic layer ( 3 ) with a combination of simultaneously sintering and applying pressure to the first piezoceramic layer ( 2 ) against the second piezoceramic layer ( 3 ). 2. The method according to claim 1 , characterized in that the electrically conductive contact layer ( 4 ) is dipped at least partially into a paste that serves to form the joining material ( 9 ) in order to provide the electrically conductive contact layer ( 4 ) with the joining material ( 9 ). 3. The method according to claim 1 , characterized in that the joining material ( 9 ) is based on at least one of silver, a silver compound and a silver alloy, wherein the silver or, respectively, the silver compound and/or the silver alloy is filled with a further material. 4. The method according to claim 1 , characterized in that that the joining material ( 9 ) is connected to the first piezoceramic layer ( 2 ) and the second piezoceramic layer ( 3 ) by means of sintering. 5. The method according to claim 4 , characterized in that the joining material ( 9 ) is connected to the contact layer ( 4 ) by means of sintering. 6. The method according to claim 1 , characterized in that the joining material ( 9 ) is based on silver or a silver compound. 7. The method according to claim 1 , characterized in that the joining material ( 9 ) is connected to the contact layer ( 4 ) by means of sintering. 8. The method according to claim 1 , characterized in that the contact layer ( 4 ) protrudes out of the composite comprising the first piezoceramic layer ( 2 ) and the second piezoceramic layer ( 3 ). 9. The method according to claim 1 , characterized in that the electrically conductive contact layer ( 4 ) is formed by a metallic insert ( 4 ). 10. The method according to claim 1 , characterized in that the first piezoceramic layer ( 2 ) and the second piezoceramic layer ( 3 ) are connected via the joining material to the contact layer ( 4 ) inserted between the same such that said first piezoceramic layer and said second piezoceramic layer have at least approximately congruent connection cross-sectional surfaces.
Assignees
Inventors
Classifications
Piezoelectric device making · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9502634B2 cover?
- An electrically conductive contact layer ( 4 ) is provided with a joining material ( 9 ) during a method for producing a piezoelectric component ( 1 ), in particular a piezoelectric sensor ( 1 ). To this end, the electrically conductive contact layer ( 4 ) can be dipped into a paste that serves to form the joining material ( 9 ). The contact layer ( 4 ) provided with the joining material ( 9 ) …
- Who is the assignee on this patent?
- Bosch Gmbh Robert
- What technology area does this patent fall under?
- Primary CPC classification H01L41/0477. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).