Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9502624-B2
Application number	US-16297406-A
Country	US
Kind code	B2
Filing date	May 18, 2006
Priority date	May 18, 2006
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus.
The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10 , and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10 . The first resin molding 40 has the recess 40 c comprising the bottom surface 40 a and the side surface 40 b formed therein, and the second resin molding 50 is placed in the recess 40 c . The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

First claim

What is claimed is:

1. A surface mounted light emitting apparatus comprising:
a light emitting device,
a first resin molding which integrally molds a first lead whereon the light emitting device is mounted and a second lead which is electrically connected to the light emitting device, and
a second resin which covers the light emitting device,
wherein the first resin molding has a single recess for receiving said light emitting device, said recess comprising, in a cross-sectional view, a single bottom surface and a single side surface at each side of the recess made from the first resin molding, a shape of said recess at the single bottom surface being substantially oval, circular, rectangular, pentagon or hexagon, a front face of the first lead and a front face of the second lead being exposed from the first resin molding at the single bottom surface of the recess, with the light emitting device being mounted on the exposed portion of the first lead, said single side surface continuously maintaining a substantially constant inclination from a top of said recess to said single bottom surface; and
the first resin molding and the second resin are formed from thermosetting resins, and the first resin molding includes at least one kind selected from the group consisting of silicon oxide, diffusing agent, pigment, fluorescent material, reflective material and light blocking material, and
wherein said first resin molding is disposed between the first lead and the second lead, wherein each of the first lead and the second lead has a single back side that is opposite to the bottom surface of the recess where the light emitting device is mounted, said single back side being exposed from the first resin molding, and
wherein both of said first lead and said second lead have a plate-like shape with a substantially constant thickness, and the thickness of said first lead and the thickness of the second lead are substantially the same.

2. The surface mounted light emitting apparatus according to claim 1 , wherein
the second lead has a single back side that is opposite to the bottom surface of the recess, and
wherein said single back side of the second lead is exposed from the first resin molding.

3. The surface mounted light emitting apparatus according to claim 1 , wherein
at least a part of an exposed portion of said single back side of the first lead, and
at least a part of an exposed portion of a back side of the second lead, and
at least a part of a back side of the first resin lie on substantially the same plane to form a continuous flat plane.

4. The surface mounted light emitting apparatus according to claim 1 , wherein an exposed portion of the back side of the first inner lead is disposed so that a heat sink touches thereon.

5. The surface mounted light emitting apparatus according to claim 1 , wherein the first resin molding is formed by transfer molding process.

6. The surface mounted light emitting apparatus according to claim 1 , wherein the first resin molding is formed from at least one kind selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin and urethane resin.

7. The surface mounted light emitting apparatus according to claim 1 , wherein the second resin molding includes at least one kind selected from the group consisting of filler, diffusing agent, pigment, fluorescent material and reflective material.

8. The surface mounted light emitting apparatus according to claim 1 , wherein said thermosetting resin of the first resin molding integrally molds said first lead and said second lead.

9. The surface mounted light emitting apparatus according to claim 1 , wherein said first resin molding disposed between the first lead and the second lead separates the first lead from the second lead below the recess.

10. The surface mounted light emitting apparatus according to claim 1 , wherein the front face of the first lead, the front face of the second lead and a front face of the first resin molding disposed between the first lead and the second lead are on the same plane at the single bottom surface of said recess.

11. The surface mounted light emitting apparatus according to claim 1 , wherein the single bottom surface of said recess is flat.

12. The surface mounted light emitting apparatus according to claim 1 , wherein an inclination angle between the side surface and the single bottom surface of said recess is 95 to 150 degree.

13. The surface mounted light emitting apparatus according to claim 1 , wherein a surface of said first lead and a surface of said second lead are roughened so as to increase a contact area with the first resin molding.

14. The surface mounted light emitting apparatus according to claim 1 ,
wherein the second lead has a single back side that is opposite to the bottom surface of the recess where the light emitting device is mounted, said back side of the second lead being exposed from the first resin molding, and
wherein a resin insulation member extends between and touches portions of the respective back sides of said first lead and said second lead, to prevent short-circuiting between the respective back sides of said first lead and said second lead.

15. A surface mounted light emitting apparatus comprising:
a light emitting device,
a first resin molding which integrally molds a first lead whereon the light emitting device is mounted and a second lead which is electrically connected to the light emitting device, and
a second resin which covers the light emitting device,
wherein the first lead has a first inner lead and a first outer lead with the first inner lead having the light emitting device mounted thereon and being electrically connected to a first electrode of the light emitting device, and the first outer lead being exposed from the first resin molding;
the second lead has a second inner lead and a second outer lead with the second inner lead being electrically connected to a second electrode of the light emitting device and the second outer lead being exposed from the first resin molding;
the first resin molding has a single recess for receiving said light emitting device, said recess comprising, in a cross-sectional view, a single bottom surface and a single side surface at each side of the recess made from the first resin molding, a shape of said recess at the single bottom surface being substantially oval, circular, rectangular, pentagon or hexagon, a front face of the first inner lead and a front face of the second inner lead being exposed from the first resin molding at the single bottom surface of the recess, with the light emitting device being mounted on the exposed portion of the first inner lead, said single side surface continuously maintaining a substantially constant inclination from a top of said recess to said single bottom surface;
the first resin molding and the second resin are formed from thermosetting resins, and the first resin molding includes at least one kind selected from the group consisting of silicon oxide, diffusing agent, pigment, fluorescent material, reflective material and light blocking material, and
wherein said first resin molding is disposed between the first inner lead and the second inner lead,
wherein each of the first lead and the second lead has a single back side that is opposite to the bottom surface of the recess where the light emitting device is mounted, and said single back side is exposed from the first resin molding, and
wherein both of said first lead and said second lead have a plate-like shape with a substantially constant thickness, and

Assignees

• Kuramoto Masafumi
• Kishimoto Tomohisa
• Nichia Corp

Inventors

• Kuramoto Masafumi
• Kishimoto Tomohisa

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title