Light emitting device and method of manufacturing the same
US-9287472-B2 · Mar 15, 2016 · US
Method for manufacturing light emitting device
US9502610B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502610-B2 |
| Application number | US-201514933208-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 5, 2015 |
| Priority date | Nov 7, 2014 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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Abstract
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A method for manufacturing a light emitting device, includes a first step of mounting a light emitting element on a support base with a bump; and a second step of clamping the support base and the light emitting element and pressing between a lower molding die and an upper molding die to plastically deform the bump, and injecting the compound of a cover member into a mold cavity between the lower molding die and the upper molding die and curing the compound to form the cover member that covers at least a lower surface of the light emitting element after the first step.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a light emitting device, comprising: a first step of mounting a light emitting element on a support base with a bump; and a second step of clamping the support base and the light emitting element and pressing between a lower molding die and an upper molding die to plastically deform the bump, and injecting a compound of a cover member into a mold cavity between the lower molding die and the upper molding die and curing the compou…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9502610B2 cover?
- A method for manufacturing a light emitting device, includes a first step of mounting a light emitting element on a support base with a bump; and a second step of clamping the support base and the light emitting element and pressing between a lower molding die and an upper molding die to plastically deform the bump, and injecting the compound of a cover member into a mold cavity between the low…
- Who is the assignee on this patent?
- Nichia Corp
- What technology area does this patent fall under?
- Primary CPC classification H01L33/0095. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).