Metal gates for semiconductor devices and method thereof
US-2024429281-A1 · Dec 26, 2024 · US
US9502583B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502583-B2 |
| Application number | US-201514980623-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 28, 2015 |
| Priority date | Dec 29, 2014 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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A method for forming a semiconductor device includes providing a substrate structure, which includes a nanowire structure supported by two isolation regions on a substrate. The nanowire structure includes a first nanowire and a second nanowire having different high mobility semiconductor materials and conductivity types. A multi-layer film structure is formed surrounding the nanowire structure and includes a conductive material layer sandwiched between two dielectric layers. A plurality of first electrodes are formed surrounding the multi-layer film structure surrounding a channel region of the first nanowire, and a plurality of second electrodes are formed surrounding the multi-layer film structure surrounding a channel region of the second nanowire. A third electrode is formed to contact one end of the nanowire structure, and a fourth electrode is formed to contact the other end of the nanowire structure. A fifth electrode is formed and coupled to a center portion of the nanowire structure.
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What is claimed is: 1. A method for forming a semiconductor device, comprising: providing a substrate structure, the substrate structure including: a substrate; a plurality of isolation regions in the substrate; a cavity between adjacent isolation regions; and a nanowire structure having a first nanowire and a second nanowire suspended in the cavity, the first and second nanowires, respectively, including a first end region, a channel region, and a second end region; wherei…
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