Wafer processing apparatus and wafer processing method
US-2024395512-A1 · Nov 28, 2024 · US
Thin film layer and manufacturing method thereof, substrate for display and liquid crystal display
US9502571B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502571-B2 |
| Application number | US-201314361131-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 19, 2013 |
| Priority date | Apr 11, 2013 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A thin film layer and manufacturing method thereof, a substrate for display and a liquid crystal display are provided. The embodiments according to the present invention can solve the problem that the gradient at the edge of the thin film layer produced with current methods is too steep or perpendicular, thus the thin film layer deposited in the next step easily has step coverage defect or even breakage. The thin film layer of the embodiments of the present invention comprises a plurality of sub-layers with different densities, wherein, the density of an upper sub-layer is smaller than that of a lower sub-layer. The yield and reliability of the thin film transistor and the thin film transistor liquid crystal display produced with the thin film layer of the embodiments of the present invention are high.
First claim
Opening claim text (preview).
The invention claimed is: 1. A thin film layer, comprising a plurality of sub-layers with different densities, wherein, an upper sub-layer has a density smaller than that of a lower sub-layer, and the thin film layer is at least one of an active layer and a source/drain electrode layer, and wherein the thin film layer is any of an aluminum layer, a copper layer, an indium tin oxide layer, and a zinc oxide layer. 2. The thin film layer according to claim 1 , whe…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9502571B2 cover?
- A thin film layer and manufacturing method thereof, a substrate for display and a liquid crystal display are provided. The embodiments according to the present invention can solve the problem that the gradient at the edge of the thin film layer produced with current methods is too steep or perpendicular, thus the thin film layer deposited in the next step easily has step coverage defect or even…
- Who is the assignee on this patent?
- Boe Technology Group Co Ltd, Hefei Boe Optoelectronics Tech
- What technology area does this patent fall under?
- Primary CPC classification C23C14/14. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).