SOI lateral bipolar transistors having surrounding extrinsic base portions

US9502504B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9502504-B2
Application numberUS-201314134611-A
CountryUS
Kind codeB2
Filing dateDec 19, 2013
Priority dateDec 19, 2013
Publication dateNov 22, 2016
Grant dateNov 22, 2016

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Abstract

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Lateral SOI bipolar transistor structures are provided including an intrinsic base semiconductor material portion in which all surfaces of the intrinsic base not forming an interface with either a collector semiconductor material portion or an emitter semiconductor material portion, contain an extrinsic base semiconductor material portion. Each extrinsic base semiconductor material portion is of the same conductivity type as that of the intrinsic base semiconductor material portion, yet each extrinsic base semiconductor material portion has a higher dopant concentration than the intrinsic base semiconductor material portion. The intrinsic base semiconductor material portion of the lateral SOI bipolar transistors of the present application does not have any interface with surrounding insulator material layers. As such, any potential charge build-up in the surrounding insulator material layers is shielded by the extrinsic base semiconductor material portions.

First claim

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What is claimed is: 1. A semiconductor structure comprising: at least one first lateral bipolar transistor located atop a first portion of an insulator layer and comprising: an intrinsic base semiconductor material portion of a first conductivity type and having a bottommost surface, an uppermost surface, and two vertical sidewalls oriented in a width-wise direction; a first horizontal semiconductor material portion of said first conductivity type positioned between said botto…

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What does patent US9502504B2 cover?
Lateral SOI bipolar transistor structures are provided including an intrinsic base semiconductor material portion in which all surfaces of the intrinsic base not forming an interface with either a collector semiconductor material portion or an emitter semiconductor material portion, contain an extrinsic base semiconductor material portion. Each extrinsic base semiconductor material portion is o…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H10D62/184. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).