Semiconductor devices, semiconductor structures and methods for fabricating a semiconductor structure
US-12176346-B2 · Dec 24, 2024 · US
US9502504B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502504-B2 |
| Application number | US-201314134611-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 19, 2013 |
| Priority date | Dec 19, 2013 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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Lateral SOI bipolar transistor structures are provided including an intrinsic base semiconductor material portion in which all surfaces of the intrinsic base not forming an interface with either a collector semiconductor material portion or an emitter semiconductor material portion, contain an extrinsic base semiconductor material portion. Each extrinsic base semiconductor material portion is of the same conductivity type as that of the intrinsic base semiconductor material portion, yet each extrinsic base semiconductor material portion has a higher dopant concentration than the intrinsic base semiconductor material portion. The intrinsic base semiconductor material portion of the lateral SOI bipolar transistors of the present application does not have any interface with surrounding insulator material layers. As such, any potential charge build-up in the surrounding insulator material layers is shielded by the extrinsic base semiconductor material portions.
Opening claim text (preview).
What is claimed is: 1. A semiconductor structure comprising: at least one first lateral bipolar transistor located atop a first portion of an insulator layer and comprising: an intrinsic base semiconductor material portion of a first conductivity type and having a bottommost surface, an uppermost surface, and two vertical sidewalls oriented in a width-wise direction; a first horizontal semiconductor material portion of said first conductivity type positioned between said botto…
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