Embedded sheet capacitor
US-2015130024-A1 · May 14, 2015 · US
Embedded sheet capacitor
US9502491B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502491-B2 |
| Application number | US-201514791164-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 2, 2015 |
| Priority date | Nov 13, 2013 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A multilayer capacitor is provided that includes a plurality of vias configured to receive interconnects from a die.
First claim
Opening claim text (preview).
We claim: 1. A multilayer capacitor, comprising: one or more first metal layers interleaved with one or more second metal layers, the one or more first metal layers and the one or more second metal layers separated by one or more dielectric layers; and a plurality of vias through the multilayer capacitor including a first via and a second via, wherein the first via is configured to receive a first die interconnect and the second via is configured to receive a second die intercon…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9502491B2 cover?
- A multilayer capacitor is provided that includes a plurality of vias configured to receive interconnects from a die.
- Who is the assignee on this patent?
- Qualcomm Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W44/601. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).