Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US9502389B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502389-B2 |
| Application number | US-201414575327-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 18, 2014 |
| Priority date | Mar 5, 2014 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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Official abstract text for this publication.
Discussed is a display device including a wiring substrate having a first electrode and a second electrode formed on different surfaces, a conductive adhesive layer configured to cover the wiring substrate, and a sub-pixel portion coupled to the conductive adhesive layer to have a plurality of light emitting portions that emit different color lights, wherein the sub-pixel portion has a plurality of first conductive electrodes corresponding to the plurality of light emitting portions, and a second conductive electrode as a common electrode for the plurality of light emitting portions, and wherein an electrode hole is formed on the wiring substrate to electrically connect the second electrode to the second conductive electrode.
Opening claim text (preview).
What is claimed is: 1. A display device, comprising: a wiring substrate having a first electrode and a second electrode formed on different surfaces; a conductive adhesive layer configured to cover the wiring substrate; and a sub-pixel portion coupled to the conductive adhesive layer to have a plurality of light emitting portions that emit different color lights, wherein the sub-pixel portion has a plurality of first conductive electrodes corresponding to the plurality of li…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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