Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
3D integrated circuit package processing with panel type lid
US9502383B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502383-B2 |
| Application number | US-201414206870-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 12, 2014 |
| Priority date | Mar 12, 2014 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
Presented herein is a package comprising a carrier device of a device stack and at least one top device of the device stack mounted on a first side of the carrier device. A lid is mounted on the first side of the carrier device, with a first portion of the lid attached to the carrier device and a second portion of the lid extending past and overhanging a respective edge of the carrier device. The lid comprises a recess disposed in a first side, and the at least one top device is disposed within the recess. A thermal interface material disposed on the top device and contacts a surface of the recess.
First claim
Opening claim text (preview).
What is claimed is: 1. A package comprising: a carrier device of a device stack; at least one top device of the device stack, the at least one top device mounted on a first side of the carrier device; and a lid mounted on the first side of the carrier device, the lid including a rim surrounding a recess and being laterally spaced apart from the recess, the rim having a lowermost surface defining a rim surface, and wherein a first portion of the rim surface is attached to the f…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9502383B2 cover?
- Presented herein is a package comprising a carrier device of a device stack and at least one top device of the device stack mounted on a first side of the carrier device. A lid is mounted on the first side of the carrier device, with a first portion of the lid attached to the carrier device and a second portion of the lid extending past and overhanging a respective edge of the carrier device. T…
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).