Electronic device and method of manufacturing the same
US-2024404904-A1 · Dec 5, 2024 · US
Lid attach process and apparatus for fabrication of semiconductor packages
US9502373B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502373-B2 |
| Application number | US-201414543307-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 17, 2014 |
| Priority date | Mar 29, 2012 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
An adhesive dispenser comprises a dispensing head. The dispensing head comprises an adhesive material applicator portion on a first level of the dispensing head. The adhesive material applicator portion corresponds to a periphery of a package. The dispensing head also comprises a thermal interface material (TIM) applicator portion on a second level of the dispensing head different from the first level. The TIM applicator portion corresponds to a die of the package. The dispensing head further comprises an adhesive material conduit configured to supply the adhesive material applicator portion with an adhesive material. The dispensing head additionally comprises a TIM conduit configured to supply the TIM applicator portion with a TIM.
First claim
Opening claim text (preview).
What is claimed is: 1. An adhesive dispenser, comprising: a dispensing head comprising: an adhesive material applicator portion on a first level of the dispensing head, the adhesive material applicator portion corresponding to an entirety of a periphery of the dispensing head; a thermal interface material (TIM) applicator portion on a second level of the dispensing head different from the first level, the TIM applicator portion corresponding to a center of the dispensing head;…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9502373B2 cover?
- An adhesive dispenser comprises a dispensing head. The dispensing head comprises an adhesive material applicator portion on a first level of the dispensing head. The adhesive material applicator portion corresponds to a periphery of a package. The dispensing head also comprises a thermal interface material (TIM) applicator portion on a second level of the dispensing head different from the firs…
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W74/01. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).