Device and method with physical unclonable function

Patent metadata

Field	Value
Publication number	US-9502356-B1
Application number	US-201514645618-A
Country	US
Kind code	B1
Filing date	Mar 12, 2015
Priority date	Mar 12, 2015
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A physical unclonable function device, an encryptable electronic device, and a process for fabricating the physical unclonable function device are described. In an implementation, a physical unclonable function device includes an integrated circuit device including an active layer, the active layer including an electrode array with multiple electrodes; and a physical unclonable function coating disposed on the active layer, wherein the physical unclonable function coating includes a physical unclonable material arranged in a random configuration.

First claim

What is claimed is:

1. A physical unclonable function device, comprising:
an integrated circuit device including an active layer, the active layer including an electrode array with multiple electrodes;
a physical unclonable function coating disposed on the active layer, wherein the physical unclonable function coating comprises a dielectric material, and wherein the physical unclonable function coating includes a physical unclonable material arranged in a random configuration;
wherein the physical unclonable function coating includes a glass material and the physical unclonable material includes glass beads; and
a distinct capacitance between at least two electrodes of the electrode array is used as a unique identifier in the physical unclonable function device depending on a density of the physical unclonable function material and a distance between the at least two electrodes of the electrode array.

2. The physical unclonable function device of claim 1 , wherein the glass beads are spheres.

3. The physical unclonable function device of claim 2 , wherein the spheres have a diameter of 1 μm.

Assignees

• Maxim Integrated Products

Inventors

• Parvarandeh Pirooz

Classifications

• H10W74/147

  the encapsulations being multilayered · CPC title

• H10W46/601

  for use after dicing · CPC title

• H10W46/407

  for wireless electrical read out · CPC title

• H10W74/473

  containing a filler · CPC title

• H10W74/137

  the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence) · CPC title