Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Ball-grid-array package, electronic system and method of manufacture
US9502345B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9502345-B2 |
| Application number | US-70584610-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 15, 2010 |
| Priority date | May 21, 2008 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
A multiple-chip-package (MCP) has multiple chip groups and multiple package terminal groups for electrical connections in the MCP. Semiconductor chips of the same chip group are electrically connected to the package terminals of the same package terminal group, while package terminals of different chip groups are electrically connected to the package terminals of different package terminal groups.
First claim
Opening claim text (preview).
We claim: 1. A multichip package comprising: a substrate; a plurality of chips mounted to a first surface of the substrate, the plurality of chips comprising a first chip group of plural chips and a second chip group of plural chips; a ball grid array attached to a second surface of the substrate providing communication terminals of the package, the ball grid array comprising a first ball group and a second ball group; a first set of electrical connections to transmit at lea…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9502345B2 cover?
- A multiple-chip-package (MCP) has multiple chip groups and multiple package terminal groups for electrical connections in the MCP. Semiconductor chips of the same chip group are electrically connected to the package terminals of the same package terminal group, while package terminals of different chip groups are electrically connected to the package terminals of different package terminal groups.
- Who is the assignee on this patent?
- Youn Sunpil, Oh Kwanyoung, Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).